国家/地区 中国（8）
IPC部 C（8） H（4） B（2）
IPC大类 C08（8） C09（8） H05（4）
IPC小类 C08L（8）
IPC C08L063/00（8）
发明人
公开年 2021（8）
申请年 2020（5）  2021（3） 
专利权人

Preparation of graphene insulating and thermally conductive sheet for electric vehicle power supply, involves e.g. coating surface material on surface of middle layer, and hot pressing to form surface layer of thermal conductive sheet.

JIA T, HONG W, ZHOU R, XI X, YANG F, LI M

Corrosion resistant polyethylene water supply pipe material comprises base layer and anticorrosive graphene coating comprising polyethylene, color master batch, epoxy resin and dispersant.

LIU J, WANG J, LI H

Lignin derivative-based phosphorus-containing epoxy resin used for forming composite material for flame retardant materials, coatings, microelectronic packaging materials, and adhesives, comprises structures.

YANG W, DING H, MA P, XU P

Flexible metal-based graphene electric heating material, comprises flexible insulating layer, flexible graphene resistance layer, flexible insulating layer, and metal substrate arranged sequentially from top to bottom.

LI Y, LOU M

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Graphene multilayer circuit board heating chip comprises epoxy resin glass fiber plate as substrate layer, electrode layer connected with graphene layer, and epoxy resin glass cloth as top layer.

CHEN L

Preparing improved thermal insulation graphene floor heating film comprises e.g. coating on leveled ground to form base film after leveling construction ground, and base film is hollow titanium oxide powder, and main material of base film.

YU J, FENG X

Electronic skin comprises e.g. encapsulation layer arranged on sensing layer, glue layer arranged on bottom of base layer and release paper arranged on glue layer, base layer and packaging layer are provided with heat dissipation layer.

JIANG Z, LI W