国家/地区 中国（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08L（5） C08K（4） C08G（2）
IPC C08L063/02（5）
发明人
公开年 2023（5）
申请年 2023（5）
专利权人

Plug hole resin with low temperature resistance and high thermal conductivity used in circuit board production technology, e.g. deep sea, deep space and polar detection field comprises epoxy resin, reactive diluent, latent curing agent, imidazole curing accelerator, antifoaming agent, and filler.

LI Q, YANG X, JIANG M, ZHANG Z, HE Z, HU B, DENG W, CHEN L

Thermosetting high temperature resistant conductive shielding material comprises resin matrix, curing agent, coupling agent, functional filler, and organic solvent.

LIN Y, JIANG X, FANG W, CHEN F

Preparing a nano conductive adhesive useful in e.g. biological medicine, catalysis and magnetic recording material, comprises e.g. obtaining dispersion liquid one, dripping the electrolyte solution and stirring to obtain water-in-oil emulsion, mixing and dispersing to obtain dispersion liquid two.

HUANG Y, LIU L, ZHU P, LI J

Graphene hybrid composite material used in conductive materials, comprises porous network graphene and epoxy resin perfused and cured in porous network graphene, which is obtained by combining poly-p-phenylene terephthalamide on graphene sheet, freeze-drying and performing carbonization treatment.

YANG F

Preparing silicon dioxide filling type epoxy resin copper-clad plate by vacuum-drying nano-silicon dioxide powder, mixing with gamma-aminopropyltriethoxysilane, adding to xylene, drying, dispersing oxidized graphene- silicon dioxide composite material, covering copper foil and curing.

XIE J, WANG X, CHEN Y