国家/地区 中国（3） 韩国（2）
IPC部 C（5）
IPC大类 C08（5） C09（2）
IPC小类 C08L（5） C08K（4） C09D（2）
IPC C08L067/00（5）
发明人
公开年 2023（5）
申请年 2022（5）
专利权人

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Preparing insulating and heat-dissipating paint by adding resin diluent and solvent to matrix resin, stirring, adding amine neutralizer, additives, fumed silica, silane coupling agent and insulating and heat-dissipating fillers to pretreated matrix resin, stirring and combining with ground carbon.

LIN Y, LI K

Halogen-free flame-retardant thermoplastic polyurethane comprises thermoplastic polyurethane elastomer, phosphorus-based halogen-free flame retardant, modified chitosan, modified polyester fiber, lubricant including pentaerythritol ester, tris (butoxyethyl) phosphate, and polyurethane prepolymer.

PAN C, CHEN S

Composition for manufacturing chemical detection sensor for detecting chemical substances comprises graphene nanoplatelets, polyaniline, alkyl cellulose, 2-ethoxyethanol, ester-based resin, curing agent, ammonium hydroxide and carbon black.

SHIM C, KU H

Compostable antibacterial material useful for recyclable packaging product, comprises polylactic acid, polybutylene adipate terephthalate, antibacterial material, lubricant, antioxidant, filler, plasticizer, antifoaming agent and anti-hydrolytic agent.

ZHOU X, GONG X, LI W, GAO S, ZHOU R, KEAN B F, LI S