国家/地区 中国（9）
IPC部 C（9） H（9）
IPC大类 C08（9）
IPC小类 C08J（9）
IPC C08L079/08（9）
发明人 LIANG X（2） SUN R（2） ZHAO T（2）
公开年 2019（2） 2021（2） 2022（2）
申请年 2021（3） 
专利权人

Use of electromagnetic material modification method in preparing polyimide foam electromagnetic shielding material.

SHI J, YANG D, CHAI X, LU X, DING Z

Flexible heating film comprises conductive structure comprising carbon nanotubes and/or graphene, and polyimide backbone that is chemically linked to aminated conductive structure via anhydride bonds.

ZHENG T, ZHANG M, ZHANG Y, MAO O, ZUO B

Bendable electro-thermal film device comprises polyimide base layer coated with organic electric heating film on surface and organic electro-thermal film comprises e.g. graphene, multi-wall carbon nano-tube and carbon black granules.

CHEN D, YANG Y

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Photosensitive polyimide resin composition comprises photosensitive polyimide derivative, photoinitiator, free radical polymeric compound, solvent, alumina, graphene, inorganic clay, silicon oxide and zinc oxide.

HUANG T, ZHUANG C, SHI Y, XIE K, HUANG T C, CHUANG C C, SHIH Y C, HSIEH K H

Composite film comprises substrate film composed of graphene, high molecular polymer, curing agent and coating layer.

SUN R, YE H, ZHAO T, ZHANG B, HU Y, LIANG X

Graphene oxide-modified electric heating film used in heating apparatus, has superposed conductive layer and heat generating layer formed by irradiation of graphene oxide-containing ink that contains graphene oxide and resin binder.

TANG D, ZHANG J, LIANG M

Preparation of graphene modified polyimide composite film used in flexible circuit board, involves coating graphene-modified polyimide composite layer on surface of polyimide film.

MIN Y, WENG L, LIU Y, QI F, HE T

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN