国家/地区 中国（6） 日本（2）
IPC部 B（8） C（8） H（2）
IPC大类 B32（8） C08（8） H01（2）
IPC小类 B32B（8）
IPC C08L079/08（8）
发明人 KIGUCHI K（2） LIU J（2） SHIMADA A（2）
TSUCHIYA H（2）
公开年 2021（8）
申请年 2020（6）  2019（2） 
专利权人 TORAY IND IN.（2）

Cured product used for multilayer sheet, comprises composition comprising resin or resin precursor, and filler having preset aspect ratio, and has preset thermal conductivity and elastic modulus.

KIGUCHI K, TSUCHIYA H, SHIMADA A

Composition e.g. sheet-like composition for forming cured material, comprises resin containing polyimide resin, and filler containing two fillers having preset aspect ratio and average maximum length in preset volume ratio.

KIGUCHI K, TSUCHIYA H, SHIMADA A

Preparing organic substrate composite material comprises e.g. preparing semi-curing structure, pre-treating fiber filler, implanting into semi-curing structure, preparing filler solution and stable film structure, freezing and drying.

ZHANG J, CAO L, WANG Q

Cigarette film comprises functional layer, core layer and secondary functional layer, where core layer is located between functional layer and sub-functional layer, and functional layer is prepared using copolymerized ternary polypropylene.

JIANG S, CHEN D, CHEN Z, XIAO J, HU B, HUANG W

Environmentally friendly flame-retardant thermal insulation PPR pipe comprises antibacterial layer, main body layer, waterproof layer and flame-retardant layer made of polyethylene particles, graphene powder and brucite grafted polyimide.

MU X

Graphene/polymer composite thermally conductive insulating film useful for heat dissipation of energy vehicle battery pack comprise insulating layer, thermally conductive filler includes aluminum nitride, silicon carbide, and aluminum oxide.

LIU J, ZHOU G

Preparing carbon fiber material useful as heat-resistant or heat-insulating material in high-temperature environment comprises hot pressing and molding resin base material, graphene nano sheet, nitride of silicon nitride or boron nitride.

ZHANG H, YU S, ZHANG D, DUAN H

Hot melt prepreg processing borosilicate phenolic resin comprises phenol, aldehyde, boron-containing compound, silicate, modifier and toughening agent, modifier, and toughening agent.

YAO Y, WEI X, LIU J, WANG L, LIU H, TIAN M