国家/地区 中国（14）
IPC部 C（14）
IPC大类 C08（14）
IPC小类 C08L（14）
IPC C08L083/07（14）
发明人 JIANG X（3） CHEN J（2） LIN Y（2）
LIU W（2） WU X（2） XIANG L（2）
公开年 2022（8） 2023（6）
申请年 2022（14）
专利权人 CHANGZHOU WI.（2） DONGGUAN JIA.（2）

Highly flexible thermal gasket, comprises vinyl silicone oil (e.g. vinyl-terminated polydimethylsiloxane), hydrogen-containing silicone oil (e.g. terminal hydrogen-containing silicone oil), thermal conductive filler (e.g. alumina), catalyst, coupling agent, and inhibitor.

LIN Y, CHEN D, LIU W, XIANG L, JIANG X

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Heat-conducting gel for battery filling, comprises silicone A, thermal conductive filler, cross-linking agent as component A, and silicone B, catalysts, chain extender as component B, and prepared by mixing silicone A, thermally conductive filler and crosslinking agent to obtain component A.

LIN Y, CHEN F, XIANG L, JIANG X

Flake graphite-containing thermally conductive gel comprises e.g. vinyl silicone oil, heat conduction powder, flake graphite, platinum catalyst and hydrogen-containing silicone oil, and prepared by e.g. adding vinyl silicone oil and heat conduction powder, vacuum defoaming and adding flake graphite.

ZHOU Q, WU X, CHEN J

Electronic device such as chip, comprises electronic component, heat sink in which surface its is provided with magnetic layer containing permanent magnetic material, and composite thermal-conductive material comprising organic matrix and ferromagnetic particles.

FANG H, XU Y, ZHENG K

Fluorine-containing plastic heat-conducting gasket comprises resin, crosslinking agent, catalyst, heat conducting filler and fluorine plastic powder.

WU X, LI F, CHEN J

Conductive repair solution for repairing cable buffer layer ablation failure, comprises component-A (comprised of e.g. cunductive filler, catalyst, surfactant, nano copper silicide, and boron nitride) and component-B (comprised of vinyl silicone oil, thickening agent, and antifoaming agent).

LI H, RUAN Y, ZHANG F, ZHANG G, SHI Y, HAN Z, LI M, HUANG J

Addition-type organic silicon heat-conducting adhesive masterbatch comprises organic silicon monomer I, organic silicon monomer II, blocking agent, catalyst I and high heat-conducting filler.

HAN Y

Modified graphene material useful in thermally conductive composite gasket, comprises graphene and halo-containing silane structural units present on at least part of the surface of the graphene.

HE X, HUANG Y, LI Z, DING K, ZHAO X, WANG X

Insulating high thermal conductivity film, comprises base material and graphene, where base material comprises thermally conductive powder, powder modifying agent, rubber material matrix, hydrogen-containing silicon oil, inhibitor and catalyst.

HUANG X, LIN W, NONG S, LIN G