国家/地区 美国（7）
IPC部 C（7） B（5） H（4）
IPC大类 C08（7） C09（7） C01（5）
H01（4） C10（3） H05（3）
B05（2） B29（2） B33（2）
B82（2） C04（2）
IPC小类 C08K（7）
IPC C08K003/04（7）
发明人 HASEGAWA S（2） HASEGAWA SHOJI（2） KAMIYA N（2）
KAMIYA NAGISA（2） NAGISA K（2） SHEN Y（2）
SHOJI H（2）
公开年 2015（7）
申请年 2014（5） 
专利权人 GRAPHENE PLA.（2） GRAPHENE PLA.（2）

Polymer and graphene blended electroactive composite coating material for electronic applications is formed by blending specific polymer and graphene.

YEH J, CHANG K, HSU C, JI W, LU H, CHANG C, LI W, CHUANG T, LIU W, TSAI M, XU J, ZHANG G, YE R, YEH J M, CHANG K C, HSU C H, JI W F

Graphite-based carbon material used as graphene precursor for preparing graphene dispersion, comprises rhombohedral graphite layer and hexagonal graphite layer, and has specified rate calculated based on X-ray diffraction method.

HASEGAWA S, KAMIYA N, HASEGAWA SHOJI, KAMIYA NAGISA, SHOJI H, NAGISA K, SHEN Y

Method for manufacturing carbon-metal composite, involves reacting composition with specific amount of graphene, providing carbon compound in composition, and providing carbon nanotube with carbon-metal composite.

GONG S Y, LEE S Y, CHOE H, LEE C, LI X, LI Z, CUI X, KONG X, GONG S

Coated strip or sheet comprises steel strip or sheet, zinc (alloy) coating on steel strip or sheet, coating system for inhibiting corrosion, and top coat in which coating system contains corrosion inhibitive composition with graphene.

VAN DER WEIJDE D H, BOEHM S, BOEHM H L M, BOEHM H, VAN DER WEIJDE D, BOHM H L M, BOHM S

Making a coating dispersion, used to make surface layer, comprises e.g. mixing graphene particles, fluorosilane coupling agent and first solvent, concentrating obtained first dispersion, and mixing it with fluoropolymer particle dispersion.

ZHANG Q, QI Y, GARDNER S J, HU N

Graphite-type carbon raw material used as graphene precursor, has rhombohedral system graphite layer and hexagonal system graphite layer in ratio more than preset value, as measured using peak intensities specific planes of layers.

HASEGAWA S, KAMIYA N, SHOJI H, NAGISA K, HASEGAWA SHOJI, KAMIYA NAGISA, SHEN Y

Molding composition for a semiconductor package comprises a liquid crystal thermosetting polymer resin and graphene oxide.

JI S Y, KIM S H, CHI S, KIM S