国家/地区 中国（6）
IPC部 C（6）
IPC大类 C09（6）
IPC小类 C09J（6）
IPC C09J011/04（6）
发明人 LIU G（2） LU R（2） ZHU L（2）
公开年 2021（5）
申请年 2020（6）
专利权人 SHENGDA TECH.（2）

Double-component addition type heat-conducting silica gel useful for radiating light-emitting diode lighting chip comprises base silicone oil, catalyst, thermally conductive filler, reinforcing and toughening additives, hydrogen-containing silicone oil, inhibitor, and graphene.

CAO Y, CHEN W

Low density high temperature resistant pouring sealant comprises vinyl silicone oil, cross-linking agent, metal-organic frame material, heat-conducting filler, platinum catalyst and inhibitor.

LU R, ZHU L, LIU G

LED packaging glue comprises vinyl silicone oil, phenyl silicone oil, vinyl silicone resin, platinum catalyst, dendrimer graphene composite material, dendrimer gold/silver nanocrystalline composite material and vinyl silicone oil.

LUO Y, GUO Q, YI B, ZHANG J, WU X

Peeling and disassembling adhesive on-demand, comprises e.g. simultaneously adding ion conductive fillers and electronic conductive fillers to bonding precursor, and uniformly mixing.

WEI Y

Low-density organosilicone electronic potting adhesive, comprises vinyl silicone oil, hydrogen-containing silicone oil, heat conducting filler, inhibitor, modified chopped carbon fiber, and catalyst.

LU R, ZHU L, LIU G, DONG J

Electrically conductive silicone system adhesive comprises silicone matrix resin, silver powder, graphene, vinyl silicone oil, hydrogen-containing silicone oil, catalyst, inhibitor, coupling agent and thixotropic agent.

KONG Q, ZHOU Z, WEI X