国家/地区 中国（25）
IPC部 C（26） B（4） H（2）
IPC大类 C08（26）
IPC小类 C09K（26） C08K（25） C08L（25）
C08J（10） B29B（2） B29C（2）
B29D（2） C08G（2）
IPC C09K005/14（26）
发明人 QU B（4） ZHU Y（4） LI J（3）
LIU Y（3） MA Q（3） XU H（3）
XU W（3） DI L（2） LIU F（2）
LIU T（2） LUO Y（2） WANG Z（2）
WU Z（2） ZHANG H（2） ZHANG Y（2）
公开年 2019（26）
申请年 2019（23）  2018（3） 
专利权人 CREATIVE SUC.（2） JIANGSU JIAN.（2）

Polyimide-grafted polyethylene glycol composite solid-solid phase change material comprises polyimide, graphene oxide and polyethylene glycol as main ingredients.

ZHANG H, ZHANG Q, ZHU Y, HUANG C, JI R, HUANG F, XIA Y, WEI S, SUN L, XU F

Low-density halogen-free flame-retardant graphene heat conducting silica gel useful in high-power light-emitting diode and electric vehicle battery seals, comprises base material, catalyst, hydrogen-containing silicone oil and inhibitor.

YANG B, WEN F, LI Y, ZHANG S, HUANG G, GUO H, LI S

Rubber-based graphene thermal interface material comprises rubber matrix, metal filler, nitride, graphene, and coupling agent.

FAN Y, CHENG Y, FEI W

Thermally conductive silicone rubber composite material comprises e.g. methylphenyl vinyl silicone rubber, modified graphene oxide, boron nitride and aluminum oxide.

WU J, ZHANG G, CHEN G

Heat-conducting polymer film comprises polymer matrix, uniformly dispersed and highly oriented graphene, second heat conducting filler, surface processing agent, filling agent and processing auxiliary agent.

XU H, XU W, ZHU Y, DI L, LIU F, LIU T, LIU Y, QU B, MA Q, LI J

Graphene/boron nitride/metal fiber/polyamide compound for preparing heat-conducting plastic for high-power LED lamps, comprises polyamide, graphene, boron nitride, polyhydroxy hyperbranched polyamide, metal fiber.

ZHANG N

Double-network polyetheretherketone composite material used for electronics, automotive energy and aerospace applications, comprises polyetheretherketone/multi-walled carbon nanotube composite material and graphene nanosheet.

ZHANG H, JIANG Z, SHANG Y, GAO Y, WEI J, WANG Z

Highly thermal conductivity silicone grease comprises high thermal conductivity filler comprising modified graphene and copper powders of two different particle sizes, surface modifying agent, surface treating agent and organosilicone oil.

HUANG J, HUANG W, LIU W, LIU Z

Graphene microsphere/epoxy resin composite material has hexagonal honeycomb structure, and includes graphene microspheres, epoxy resin and curing agent.

ZENG X, LI C, SUN R, ME Y

Heat conducting complex material useful in the field of heat dissipation electronics, comprises phenolphthalein polyarylethernitrile, graphene, auxiliary fillers, dispersant, compatibilizer and lubricant.

QU M, WANG D, ZHOU G, WU L, XU P, WANG Z, ZHANG Y