国家/地区 美国（8）
IPC部 C（8）
IPC大类 C09（8）
IPC小类 C09K（8） F28F（8） C01B（5）
H01M（4） H05K（4） B32B（3）
C08K（3） C08J（2） C08L（2）
IPC C09K005/14（8）
发明人 JANG B Z（2）
公开年 2021（3）
申请年 2014（2）  2020（2） 
专利权人 NANOTEK INST.（2）

Flexible heat transfer material for thermally contacting one cell within a battery pack, comprises a matrix and a filler and the thermal conductivity of the filler is greater than the thermal conductivity of the matrix.

FLANNERY B

Elastic heat spreader film used for forming structural component, comprises graphitic film comprising graphitic crystals, and having preset thermal conductivity, electroconductivity and physical density, and elastomer or rubber.

LIN Y, JANG B Z, ZHANG B, JEAN B

Manufacture of heat-dissipating composite material used for electronic device, involves e.g. mixing inorganic binder and filler to prepare mixture, heat-treating obtained mixture, and mixing composite particles and polymer material.

CHOA Y H, RYU S H, LIM M S, CHO H B, SONG Y S, CHOA Y, LIMMINSUP, CHO H, SONG Y

Integral graphene film comprises chemically functionalized graphene sheets chemically bonded or interconnected with one another having an inter-planar spacing and non-carbon element.

ZHAMU A, JANG B Z

Preparation of graphene thermally conductive film involves coating slurry prepared by dissolving graphene oxide powder in solvent, and defoaming resultant, on substrate, drying, winding, trimming, heating, cooling, and vacuum rolling.

ZHOU B, ZHOU R, LI F, LU J

Graphene dispersant used in e.g. preparation of graphene composite powder, and graphene composite film, comprises polyaniline oligomer or derivative which is electroactive polymer, and combines with graphene via pi-pi bond.

DAI L, GU L, YU H, ZHENG Y, MA J, ZHAO H, LIU S, DING J

Composition, used in a phase change material which is useful e.g. as thermal conductivity substrate for flexible graphene electronic devices, as electrode in battery, and in a thermal storage device, comprises galactitol and mannitol.

DA SILVA A K, FLEMING E, SHI L, BIELAWSKI C W, RUOFF R S, WEN S, JI H, PETTES M, PAUL A, PAEK E, PAK A J, SELLAN D P, FLAMING E, DA SILVAA A K

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X