国家/地区 中国（12） 日本（5） 世界知识产权组织（3） 台湾（2）
IPC部 C（16）
IPC大类 C22（16）
IPC小类 C22C（16） B22F（5） C22F（5）
C01B（3） H01H（3） B22D（2）
C23C（2） H01B（2） H01L（2）
IPC C22C009/04（16）
发明人 LENG J（4） CHIBA Y（3） CHIBA YOSHIHIRO（2）
LI C（2） LIU Y（2） WANG S（2）
公开年 2016（6） 2014（3） 2018（3） 2021（2）
申请年 2015（6）  2018（3）  2013（2）  2021（2） 
专利权人 NIPPON MININ.（4） UNIV JINAN（4） JX NIPPON MI.（3）

Composite material for lift safety protecting system, in which porosity of first porous ceramic preform layer, porosity of second porous ceramic preform layer, porosity of third porous ceramic preform layer, porosity of fourth and fifth porous ceramic preform layer is equal.

CHE J, YIN Y, XUE C, YANG Q, LI C, WANG M, WANG J, GAO K, ZHU W, LI M, LU Y, HE Y

Preparation of copper infiltrated wire involves mixing nickel, manganese, iron, zinc, and copper, adding mixture into vacuum melting furnace, molding alloy solution, forging and turning alloy ingots in electric furnace, hot rolling alloy bars into discs, drawing disc, and cutting alloy wire.

ZHOU B, TIAN D, GUO C, SUN J, WANG Q, LIU X, GOU S, LIU Q, LIANG X

Preparing copper-based modified graphene oxide composite material with high thermal conductivity comprises e.g. firstly ultrasonically cleaning the H96 copper alloy in clean water, and ultrasonically cleaning in anhydrous ethanol solution.

HUANG Y, WANG S, WANG H, LI Q, FU H, QIU Z

Preparing an oxidation resistant bonded copper wire material comprises e.g. purifying raw material of the copper wire, heating, adding the melted copper solution, spraying the graphene liquid, drying and applying the antiseptic oil.

CHENG X, ZHANG L, WANG C

Copper-based composite material comprises copper, zinc, titanium and graphene.

LI L, CHEN Y, ZHAO S, MIAO Q, CAO S

Pre-made ingots useful for graphene-metal composite preparation for preparing electronic heat conduction and heat dissipating component, comprises graphene powder and metal powder comprising aluminum or copper powder.

CHEN J

Armor material comprises graphene, copper, and/or copper alloy comprising bismuth, lead, and oxygen, in specified mass ratio, and remaining copper.

GUO J, WANG X, LI J, WANG S, CHEN Z

Copper thermal radiation material used during manufacturing of e.g. electronic component, has graphene layer that is provided on copper foil or copper alloy foil with thickness of specific range.

ONO T, KAMMURI K

Graphite-enhanced composite copper-based contact material used in manufacture of e.g. switches, comprises oxide powder, carbide powder and graphene-coated copper (alloy) powder containing tin oxide and copper oxide.

LIU L, WENG W, LIN W

Electrical contact material comprises nickel plated graphene and copper alloy comprising bismuth, metal element, and copper.

GENG H, LIU Y, TENG X, LI C, LENG J