国家/地区 中国（7）
IPC部 B（7）
IPC大类 C25（7）
IPC小类 C25D（7）
IPC C25D005/56（7）
发明人 ZHAO J（2）
公开年 2021（4）
申请年 2020（2）  2021（2） 
专利权人 UNIV JILIN（2）

Preparing thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material, involves preparing thermally conductive filler/polyimide aerogel, electroplating aerogel material, and vacuum hot pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Composite current collector for use in lithium battery field, has electroplating copper layer arranged on two sides of conductive polymer substrate layer, where conductive polymer substrate layer is provided conductive material and polymer substrate.

JIAO X, WANG R, LIU Z, YAN C

Automatic production device for conductive cloth, has bracket and base plate that are fixedly connected, where bracket is located at one side of base plate and bracket is orderly provided with stirring mechanism and drying mechanism.

GUO D, HU X

Plastic surface electroplating manufacturing method involves mixing polypropylene, polybutadiene, sulfur, sulfenamide accelerant, cobalt salt, and graphene, injection molding, electroplating copper plating layer, heating, keeping temperature, and plating metal plating layer by electroplating.

HU D

Electronic component three-dimensional (3D) printing device based on selective electro-deposition comprises x-axis moving device, y-axis moving device, and z-axis moving device which are all mounted on mounting support.

WU W, WANG J, GUO J, LIU T, ZHAO J

Acrylonitrile-butadiene-styrene engineering plastic surface metal layer comprises antioxidation layer containing conductive filler, reducing filler and aqueous acrylic resin emulsion, semi-light nickel layer, and anticorrosive layer.

FANG J, XIONG Z, CHENG G

Resin plating comprises forming a graphene thin layer on a resin substrate and electroplating the resin substrate having the graphene thin layer formed on it.

BAE A H, SON S I, NAM J D, LEE J H, HWANG T S, OH J S, LEE H, EAH H B, SANG I S, JAE D N, JOON S O, JUN H L, TAE S H, HWANG T, LEE J, NAN J, PAE A, SUN S, OU J