国家/地区 美国（8）
IPC部 F（8）
IPC大类 F28（8）
IPC小类 F28F（8） B32B（5） C09K（4）
H01M（3） B01J（2） F16L（2）
F17D（2） F28D（2） H01L（2）
IPC F28F013/00（8）
发明人 RAYNEL G R J（2） VILLETTE T T（2）
公开年 2022（3） 2014（2） 2021（2）
申请年 2020（4）  2014（2） 
专利权人 ARAMCO SERVI.（2） SAUDI ARABIA.（2）

Apparatus used to install shape memory polymer based passive thermal diode, has layers comprising polyurethane layer to contact upper portion along length of pipe, polyethylene terephthalate layer, graphene layer to surround upper side of apparatus, and epoxy shell to surround graphene layer.

RAYNEL G R J, VILLETTE T T

Apparatus for improving flow in pipelines, has air gap that provides upward movement of polyethylene terephthalate (PET) layer using opposite forces of alternate sides of PET layer, and configuring graphene layer to surround shell.

RAYNEL G R J, VILLETTE T T

Apparatus for removing heat from integrated circuit devices, has thermal interface material that contacts anisotropic thermally conductive section of heat dissipation device and contacts integrated circuit device.

SWAN J, ELSHERBINI A, EID F

Flexible heat transfer material for thermally contacting one cell within a battery pack, comprises a matrix and a filler and the thermal conductivity of the filler is greater than the thermal conductivity of the matrix.

FLANNERY B

Manufacture of heat-dissipating composite material used for electronic device, involves e.g. mixing inorganic binder and filler to prepare mixture, heat-treating obtained mixture, and mixing composite particles and polymer material.

CHOA Y H, RYU S H, LIM M S, CHO H B, SONG Y S, CHOA Y, LIMMINSUP, CHO H, SONG Y

Composition, used in a phase change material which is useful e.g. as thermal conductivity substrate for flexible graphene electronic devices, as electrode in battery, and in a thermal storage device, comprises galactitol and mannitol.

DA SILVA A K, FLEMING E, SHI L, BIELAWSKI C W, RUOFF R S, WEN S, JI H, PETTES M, PAUL A, PAEK E, PAK A J, SELLAN D P, FLAMING E, DA SILVAA A K

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X

System for cooling, has micro channel comprising base with aluminum sheet metal, anodized aluminum, Teflon-coated aluminum, copper sheet metal, graphene and pyrolytic graphite, and side with copper foil, graphene and pyrolytic graphite.

DAVIS S