国家/地区 中国（11）
IPC部 F（11）
IPC大类 G06（11） F28（6） H01（6）
H05（5） F16（3） B23（2）
IPC小类 G06F（11） F28D（4） F28F（4）
H01L（4） H05K（4） B23P（2）
F16F（2） H01M（2）
IPC G06F001/20（11）
发明人 ZHENG Z（2） ZHONG M（2）
公开年 2021（6） 2022（4）
申请年 2020（4）  2021（3）  2022（3） 
专利权人 LAUREL ELECT.（2）

Aluminium graphene uniform temperature plate for flat computer internal heat dissipation, has graphene layer arranged between aluminum-based upper plate and aluminum-based lower plate, and cross-linking holes provided with aluminum-based connecting particles.

WANG G, XU X

Uniform temperature device, has base plate comprising first surface and second surface opposite to first surface, heat conducting piece arranged on first surface of substrate, and radiation layer arranged on second surface.

ZHONG M, ZHENG Z

Uniform temperature device i.e. stacked uniform temperature equalizing device, has set of heat conducting pieces arranged on first surface of base plate, and radiation layer arranged on second surface of plate.

ZHONG M, ZHENG Z

Capacitance touch control film assembly for interactive display device, has plastic plate whose top is fixedly mounted with graphene radiating plate whose front surface is movably connected with back of capacitor touch film main body.

WANG X, WANG J

Mobile phone back shell, has semiconductor refrigerating sheet whose back side surface is provided with radiating hole, where front side of back shell main body corresponding to hole is fixedly adhered with waterproof ventilating film.

CHEN X

Graphene computer radiating fan, has fan blade fixedly connected with fan body, where side of filling layer is connected with supporting layer, and lower side of supporting layer and graphene lower film layer are bonded.

GUO X, HUANG S, LI A

Thermal exchange assembly used e.g. in computing platform e.g. laptop, comprises cold plate configured to be placed on semiconductor device and including window section, and heat pipe directly coupled to cold plate and including window.

CARBONE M, HUTTULA J, MISHRA C, PAAVOLA J

Electrostatic driven double-layer solid-state refrigeration device based on electric card effect comprises e.g. PET dielectric layer arranged with graphene electrode arranged at bottom part of uppermost insulating polyimide tape.

MA R, BO Y, ZHANG Q

Heat conduction structure used in mobile device, has two heat conduction layers and metal microstructure that form stacked structure and stacked structure that is divided into two sections in direction along axis of heat conducting unit.

XIAO Y, HE M, SHIAU Y

Temperature adjustable refrigeration device, has cold-conducting bonding layer and heat-conducting bonding layer whose material made of grapheme, silver, nano-copper powder, silicone grease and liquid metal.

NI M, ZHU J, LIAO Y