国家/地区 台湾（7）
IPC部 B（7）
IPC大类 B32（7）
IPC小类 B32B（7） C09K（4） C09D（3）
H05K（3） B05D（2） B82Y（2）
C01B（2） C08K（2） C09J（2）
H01L（2）
IPC B32B015/08（7）
发明人
公开年 2021（2）
申请年 2021（2） 
专利权人

Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.

WU K, LI Y, CHANG C H, ZHU X

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Electromagnetic interference shielding film for flexible printed circuit board, consists of conductive adhesive layer formed using composition comprising acrylate solution, divalent acid ester solution, conductive particles and solvent.

YU P, LIU H, CHANG Y, HUANG S, YOU B, LIU X, ZHANG Y

Surface-metalized polymer article comprises polymer component, first layer composed of multiple graphene sheets and conducive filler coated on polymer component surface, and second layer of plated metal deposited on first layer.

LIN Y, LEE S, JHONG Y, ZHAMU A, JANG B Z, LI S

Preparing nitrogen-doped graphene, used to produce composite heat dispatching plate, comprises mixing solid-state nitrogen containing precursor with a graphene to form a mixture, and sintering the mixture under reducing atmosphere.

LIU W J, SHEN J, XIE Z Z, LIU W, XIE Z

Graphene dissipation structure for e.g. heat dissipation devices, has substrate containing surfaces, and graphene dissipation layer containing surface-modified graphene nano sheets, carrier resin and filler, in specified weight ratio.

WU M Y, HSIEH C, CHEN J, HSIEH S, LI K, XIE S, WU Y, XIE C, LI G, HSIEH C Y, CHEN J R, HSIEH S L, LI K T

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X