国家/地区 中国（11）
IPC部 C（11）
IPC大类 C08（11）
IPC小类 C08L（11）
IPC C08L079/08（11）
发明人 XU Z（11）
公开年 2021（5） 2022（4）
申请年 2021（5）  2022（4） 
专利权人 ZHEJIANG ZHO.（6）

Preparing high dielectric polyimide/graphene composite film comprises performing esterification reaction hydroxylated graphene and iron-containing metal-organic framework material, adding functionalized graphene into organic solvent solution, casting, and performing thermal imidization reaction.

SHAO C, XU Z

Polyimide-inorganic fiber cross-linked coupling insulating pull rod, formed by compounding epoxy resin and fiber fabric layer.

XU Z, CHEN Z, CHEN Y, LIN L

Gas-gel multilayer interval material useful in the field of aerospace, comprises e.g. gas gel interval layer and a reflecting screen arranged alternately.

LI S, ZHANG Y, GUO D, XU Z, WANG K, SHENG Q, SHEN C, LI X, ZHAO H

Preparing high thermal conductivity polyimide film by mixing alkynylated graphene and N,N-dimethylformamide, ultrasonically dispersing, ultrasonically dispersing magnetic boron azide and N,N-dimethylformamide, adding sodium ascorbate and triethylamine, and adding copper sulfate pentahydrate.

XU Z, XU J

Material of porous layered composite oil control bearing retainer, comprises wear-resistant layer, lipophilic layer, oil storage layer, oleophobic layer and oil sealing layer, where two of wear-resistant layer are paved with oleophylic layer.

SUO X, XU Z, XIA R, SHI C, LI J

Transparent polyimide composite conductive film comprises silver nanowire layer and graphene oxide layer attached to transparent polyimide base film surface.

JIN W, XU Z, QUE X

Graphene in-situ modified polyimide film is prepared by polycondensation of graphene grafted with aminosiloxane on the surface, diamine and dianhydride and forming into film.

XU Z, LIU G, ZHANG Q

Preparing polyimide/graphene composite thermally conductive film, involves performing polycondensation of dianhydride, crosslinking polyamic acid and polyvinyl alcohol followed by subjecting film-forming mixture to thermal imidization.

XU Z, LIU G, ZHANG Q

Preparation of polyimide composite film used for printed circuit board involves grafting nano-silica and fluorinated graphene, dispersing in N,N-dimethylformamide, sonicating, stirring, adding polyamic acid, casting and thermal imidization.

SHAO C, XIE H, LIU G, XU Z

Polyimide graphene composite film prepared by e.g. performing polycondensation reaction of dianhydride monomer and diamine monomer, adding graphene oxide powder, mixing, casting, removing solvent, and imidization.

QUE X, XU Z