国家/地区 中国（13）
IPC部 C（13）
IPC大类 C09（13） H01（2）
IPC小类 C09J（13）
IPC C09J183/07（13）
发明人 WANG Y（3） TANG R（2）
公开年 2023（7） 2022（6）
申请年 2022（13）
专利权人 NINGBO YUANC.（2）

Cyclic silicon-hydrogen bond-containing crosslinking agent useful in preparing adhesive sealant composition for inductors, comprises gamma-methacryloxypropyltrimethoxysilane, tetramethylcyclotetrasiloxane, graphene oxide, first platinum catalyst and methylbutynol.

WU Z, CAI X, LI F, WU X, ZHOU Q

Antistatic silica gel protective film comprises e.g. polyethylene terephthalate film layer, adhesive layer and polyethylene terephthalate release film, composite modified silicone pressure-sensitive adhesive, nano-silicon dioxide and nano-silicon carbide, and epoxy silane crosslinking agent.

ZHU X, SHENG F, KONG F

Condensed type fast thermosetting silicone rubber adhesive used e.g. for bonding space flexible and foldable solar cell and double-glass or single-glass solar cell plate on land, comprises condensation-type liquid silicone rubber and graphene sheets and/or their derivatives curing agent.

YU H, LU Q, SUN Y, SUN P, LIU L

Two-component silicone heat-conducting pouring sealant useful for e.g. solar industry encapsulating application, comprises component A and component B, where component A comprises aniline methyltriethoxysilane, octyltrimethoxysilane, vinyl silicone oil, ethyl silicone oil and dimethicone oil.

QIN Y

Heat-resistant and wear-resistant composite plate comprises high-temperature-resistant substrate, wear-resistant metal panel, heat-resistant adhesive layer and wear-resistant coating, heat-resistant adhesive layer includes heat-resistant adhesive layer compound.

ZHANG Y, RAN Y, XU J, DOU Q, ZU X

Graphene modified single component sealing glue useful for bonding glass, metal and ceramic comprises methyl phenyl vinyl silicone base rubber, methyl phenyl vinyl silicone oil, platinum catalyst, phenyl hydrogen containing silicone oil, silicon rubber heat stabilizer and vacuumizing and dehydrating.

WU Y, FU Y, LIU Q, NIE B, WANG Y, LV P, ZHANG Z

High thermal conductivity and anti-settling pouring sealant useful in protection of electronic element comprises vinyl silicone oil, dimethyl silicone oil, modified filler, catalyst, vinyl silicone oil, dimethyl silicone oil, modified filler, hydrogen-containing silicone oil and organic peroxide.

WU W, CHEN S, HU X, LIU R

Heat-conducting wave-absorbing material with electromagnetic shielding function has a two-layer structure, the upper layer is a heat-conducting wave-absorbing gel layer, and the lower layer is an aluminum foil layer.

ZHANG X, YANG Y, FAN J, ZHANG C, MA C, WANG Z

Thermally conductive adhesive used for bonding electronic circuit base plate for circuit board, comprises composite resin, thermally conductive filler, vinyl-terminated silicone oil, platinum catalyst, curing agent and leveling agent.

ZHONG L, LI R

Low-viscosity flame-retardant heat-conducting solvent-free polyurethane electronic potting adhesive comprises polyether polyol, modified polyurethane prepolymer, heat-conducting powder, modified graphene oxide, vinyl silicon oil, fire retardant, anti-foaming agent, dispersing agent, coupling agent.

WANG Y, TANG R