国家/地区 美国（10） 中国（8） 韩国（5） 世界知识产权组织（5） 日本（3） 欧洲专利局（EPO）（2） 台湾（2）
IPC部 C（13）
IPC大类 C09（13）
IPC小类 F28F（13） C09K（9） C01B（7）
H05K（5） B32B（3） C09D（3）
F28D（3） B82Y（2） C08J（2）
C08K（2） C08L（2） C09J（2）
H01B（2） H01L（2）
IPC F28F021/02（13）
发明人 JANG B Z（4） ZHAMU A（3） LIN Y（2）
XIONG W（2）
公开年 2014（3） 2018（3） 2022（3）
申请年 2013（3）  2017（2）  2018（2）  2022（2） 
专利权人 NANOTEK INST.（4）

Graphite tube comprises pipeline body and resin layer loaded on surface of pipeline body, where resin layer comprises phenolic resin, epoxy resin, unsaturated resin, furan resin, graphene and graphite powder.

ZHANG H, MAO Y

Graphene inorganic high thermal conductivity heat dissipation coating in heat exchange device, comprises graphene powder, and elemental silicon system inorganic slurry comprising nano-elementary silicon, alcohol, coupling agent and water.

LAI C

Heat dissipation sheet comprises e.g. graphite layer, primary graphene layer stacked on one side of graphite layer with primary adhesive layer interposed there between and secondary graphene layer stacked with secondary adhesive layer.

PARK J, YOUNG C, CHOI C Y, PARK J U, CHOI C, PIAO Z

Elastic heat spreader film used for forming structural component, comprises graphitic film comprising graphitic crystals, and having preset thermal conductivity, electroconductivity and physical density, and elastomer or rubber.

LIN Y, JANG B Z, ZHANG B, JEAN B

Integral graphene film comprises chemically functionalized graphene sheets chemically bonded or interconnected with one another having an inter-planar spacing and non-carbon element.

ZHAMU A, JANG B Z

Preparation of flake graphite-graphene thermally conductive composite material involves taking crystalline flake graphite and graphene, adding ethanol, and ultrasonicating to obtain thermally conductive filler dispersion.

BAI S, REN Y, ZHANG Y, DING T, LI J

Preparation of graphene thermally conductive film involves coating slurry prepared by dissolving graphene oxide powder in solvent, and defoaming resultant, on substrate, drying, winding, trimming, heating, cooling, and vacuum rolling.

ZHOU B, ZHOU R, LI F, LU J

Thermally conductive composite material used in electronic device e.g. CPU, comprises unitary graphene matrix material which is single crystal or polycrystalline, and contains chemically bonded graphene molecules or merged graphene planes.

ZHAMU A, XIONG W, JANG B Z, LIN Y

Composite material used for thermal-conducting material for thermal management of collagen, comprises metal matrix and graphene platelets dispersed in the metal matrix with random orientation.

KIM N P

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X