国家/地区 中国（5）
IPC部 B（5）
IPC大类 B21（5）
IPC小类 B21B（5）
IPC B21B003/00（3） C22C001/10（2）
发明人 LI X（2） ZHANG Y（2）
公开年 2022（5）
申请年 2022（5）
专利权人

Preparing copper alloy semiconductor lead frame for circuit board, comprises heating copper alloy ingots, removing oxide, aging, adding copper alloy semi-finished product silver plating bath for silver-plated plating treatment, and activating.

CAO G, LI C, XU J, YIN H

Preparing non-metallic quantum dot magnesium-lithium alloy-based composite material useful in aerospace, rail traffic, and automobile industry, comprises e.g. preparing two magnesium-lithium alloy plates, treating surface and performing multi-pass friction stir processing and multi-pass rolling.

LEI W, LU Y, LI X, CHEN X, MA K, ZHANG Y

High hardness and high nickel-chromium-molybdenum composite roll structure, has rotating ring whose one side is fixedly welded with hard scraper, and hard scraper has T-shaped structure movably attached to inner wall of circular cavity.

ZHANG D, CHEN M

Preparing high-quality electronic aluminum foil for use in conductive fields such as lithium-ion battery and capacitor, involves preparing micro-nano graphene sheet by electrolytic method, polishing aluminum foil mirror surface by mirror processing device, and cutting into electronic aluminum foil.

YIN K, WANG Z, CHU M, HU D, ZHENG L, CHEN Z, ZHENG G, ZONG Y, HE X

Preparing graphene metal layered composite material useful in aerospace industry, aviation industry and information industry, comprises pre-treating solid carbon source, growing graphene on many metal substrates and hot-pressing many graphene metal substrates.

SHAO L, LI X, ZHANG Y, LI Z, HUANG D, SHI H, DUAN Y