国家/地区 中国（5） 美国（5） 日本（4） 欧洲专利局（EPO）（3） 世界知识产权组织（3） 韩国（2） 台湾（2）
IPC部 B（8）
IPC大类 B23（8）
IPC小类 C04B（8）
IPC C04B035/645（3） C04B037/02（3） B23K020/00（2）
发明人 NOBUYUKI T（2） TERASAKI N（2）
公开年 2021（8）
申请年 2020（4）  2021（4） 
专利权人 MITSUBISHI M.（2）

Method for assisting brazing of ceramic matrix composite material and metal, involves soaking three-dimensional woven short fiber into liquid fused quartz, obtaining composite material woven by short fiber after annealing, and processing.

LI S, CHEN Y, MA Q

Composition used for manufacturing composite polycrystalline diamond, comprises diamond particle(s), boron-doped diamond particle(s), and preset amount of additive containing boron oxide powder, and nano-carbon material.

CHEN W, PAN P, SUN Y

Anti-burning material for laser cutting machine comprises high temperature resistant reflective coating formed by high temperature-resistant reflective coating, inorganic silicate solution, and nano titanium dioxide.

XU M, ZHANG W, LU S, WANG Y, YANG X

Indirect braze welding of aluminum nitride ceramic copper-clad plate by depositing active metal elements on surface of pretreated ceramic substrate, and applying composite solder on surface ceramic substrate.

ZHU W, TANG M, RAN X

Copper/graphene junction for e.g. engine compartment, comprises structure in which copper component and graphene-containing carbonaceous component are joined, active metal carbide layer, and magnesium solid solution layer in which magnesium is solid-solved in matrix phase of copper.

NOBUYUKI T, TERASAKI N

Ceramic/copper/graphene assembly used as heat radiating member, has structure in which ceramic member, copper member and graphene-containing carbonaceous member are joined, active metal carbide layer, and magnesium solid solution layer.

NOBUYUKI T, TERASAKI N

Heating material surface involves exposing surface to electromagnetic radiation source emitting first wavelength spectrum not greater than 10 percent overlap, and receiving second wavelength spectrum from surface by detector.

MATSON C, DAWSON J, FARANDOS N, DAWSON M

Semiconductor manufacturing equipment component, comprises a plate-like aluminum nitride sintered body having a placement surface on which a substrate is to be placed, an electrode is embedded in the aluminum nitride sintered body.

OOKI K, OKI K