国家/地区 中国（9）
IPC部 B（9）
IPC大类 B22（9）
IPC小类 C21D（9）
IPC C22F001/08（6） B22F009/04（4） C21D009/52（4）
C22C009/00（4） B21C037/04（3） B22F003/04（3）
B22F003/10（3） B22F003/14（3） C22C001/10（3）
C21D001/26（2） C22C001/02（2） C22C001/05（2）
C22F001/02（2） H01B013/00（2）
发明人 WANG Q（2） YANG Z（2）
公开年 2021（9）
申请年 2021（7）  2020（2） 
专利权人

Graphene bonded silver wire for packaging, comprises specified amount of graphene and silver.

PENG X, PENG S

Ultra-low chromium content copper tungsten-copper chromium integral electrical contact comprises copper tungsten arc resistant end and copper chromium conductive end.

LIU P, YANG R, ZHOU N, ZHAO J, KANG D, ZHOU X

Preparation of graphene copper wire includes ball milling graphene oxide powder and oxygen-free copper powder to obtain mixed powder, hot-press sintering mixed powder, mixing with oxygen-free copper powder to obtain graphene copper sintered body, annealing graphene copper wire and winding.

YANG Z

Preparation of copper based iron based composite electrical contact material includes preparing graphene fiber containing ferric oxide powder, modifying graphene fiber containing ferric oxide powder and pretreating base material.

ZHENG Y

Preparation of copper infiltrated wire involves mixing nickel, manganese, iron, zinc, and copper, adding mixture into vacuum melting furnace, molding alloy solution, forging and turning alloy ingots in electric furnace, hot rolling alloy bars into discs, drawing disc, and cutting alloy wire.

ZHOU B, TIAN D, GUO C, SUN J, WANG Q, LIU X, GOU S, LIU Q, LIANG X

Preparing pulse current assisted forming graphene-magnesium-based composite material involves using hot-press sintering to prepare graphene-magnesium-based composite material, forming, enhancing shaping performance and compacting structure.

YU Y, ZENG J

Preparation of graphene-aluminum composite material lead by mixing magnesium oxide and graphene, soaking, liquid nitrogen ball milling, vacuum drying, roasting, adding magnesium oxide and atomized aluminum, casting, stretching and annealing.

JIA T, HONG W, ZHOU R, XI X, YANG F, LI M

Preparing high-damping copper-aluminum-manganese shape memory alloy, involves crushing copper zirconium compound inoculant ingot, mixing inoculant particles with multi-layer graphene, ball milling, drying composite powder, and solidifying.

WANG Q, JIAO Z, YIN F, ZHANG J, LIU L, JI P, YAO C

High strength high conductivity graphene-copper composite wire comprises graphene, impurity element and copper.

YANG Z, FENG X, XIE H, PENG L, HUANG G, ZHANG W, MI X