国家/地区 中国（4） 美国（2）
IPC部 C（6）
IPC大类 C25（6）
IPC小类 C25D（6）
IPC C25D005/18（6）
发明人
公开年 2022（6）
申请年 2022（3）  2021（2） 
专利权人

Electroplating method for non-metal plating with surface absorbed with carbon black, involves placing non-metallic plating piece with surface absorbing nano-metal conductive object in first plating liquid without forced convection to perform first-plating with first preset current density.

MIAO H, ZHU K

Optimized filling holes comprise modifying insulative inner wall of blind hole with reduced graphene oxide, depositing copper in blind hole through electroplating process, removing first dry film to expose copper foil, and removing exposed copper foil.

YANG N, YEH A

Preparation of copper-tungsten graphene-containing composite material for vacuum switch electric appliance, involves preparing tungsten-copper-graphene core-shell powder, and sintering obtained graphene core shell powder.

DING Y, ZHU Z, LIANG S, ZOU J, XIAO P, CHEN Z, ZHANG Q, DENG N

Non-enzyme sensor element for detecting concentration of analyte, has catalyst layer electroplated on graphene layer, where catalyst layer comprises metal oxide and is used to oxidize analyte.

LIN Y, LIN S, CHEN Y, WANG H

Layered composite material used as heat conducting material comprises graphene layer and metal copper layer.

HU W, DENG Y, QIN Z, CHEN J, WU Z

Mercaptobenzene functionalized graphene/copper composite thermal conductive coating for electronic and biological applications, comprises graphene functionalized by mercaptobenzene and chemically connected with nano-copper through mercaptobenzene molecular junction.

ZHENG Q, LI X