国家/地区 中国（7）
IPC部 C（7）
IPC大类 C23（7）
IPC小类 C25D（7）
IPC C25D007/00（7）
发明人
公开年 2022（3）
申请年 2022（3）  2020（2） 
专利权人

Resin-modified coating useful for glove mold, prepared by forming foam layer on the surface of the old aluminum mold through multiple deposition processes, and spraying the modified resin.

SHEN H, DING Z

Conductive pre-coating useful for e.g. fuel cell titanium plate, comprises first metal particle layer distributed on surface of titanium substrate, in-situ oxidation layer covering surface of first metal particle layer, and second metal layer covering surface of in-situ oxidation layer.

LAN S, HU P, JIANG T, BI F, LI H

Multifunctional composite coating of steel structure surface comprises multi-element permeation substrate (zinc powder and aluminum powder), graphene anti-corrosion film (powdered graphene oxide and pyrrole) and fireproof outer layer (flame retardant) provided from inside to outside.

ZHANG H

Preparation of graphene-encapsulated ultra-thin nickel-63 radiation source film used in preparation of Schottky junction stacked radiation cell, involves preparing nickel chloride film, and putting graphene/nickel chloride/graphene film in vacuum environment for reduction treatment.

WANG X, WANG L, CHEN Z, YANG Y, ZHANG J, SU C, FENG H, LI P, WU W, LUO T, ZHOU C

Connector e.g. male connector, comprises electrical contact material containing metal base material and conductive coating layer containing phase made of metal other than gold, and phase made of gold or non-metallic conductive material.

KUBO T, OKADA M, SHIMIZU T, KAWAI H, KAWAI Y

Aluminum mold useful for automobile engine, e.g. the aluminum mold main body, buffer layer, graphene wear-resistant layer and zirconium oxide anti-corrosion layer are sequentially arranged from inside to outside.

ZHANG Z

Graphene-containing PCB copper composite plating solution includes a copper ion source, where the copper ion source is preferably copper chloride, copper sulfate, the content of the copper ion source is 55-95g/L, sulfuric acid is preferred.

LI A