国家/地区 中国（9）
IPC部 C（9）
IPC大类 C25（9）
IPC小类 C25D（9）
IPC C25D005/34（9）
发明人 CHEN B（2） DING Y（2） GUO W（2）
PANG Z（2） ZHANG C（2） ZHANG Q（2）
公开年 2023（6） 2022（3）
申请年 2022（9）
专利权人 GLOBAL ENERG.（2） STATE GRID F.（2）

Preparing silver-graphite-graphene layer comprises processing the surface of the substrate, pre-plating silver, silver plating, composite plating silver-graphite-graphene, and processing the plated surface.

LIN X, ZHANG Q, CHEN B, GUO W, DING Y, PANG Z, ZHANG C

Copper foil graphite sheet comprises copper foil, graphene layer continuously deposited on copper foil surface, and nickel-plated layer which is distributed in non-continuous island shape between copper foil and graphene.

CHEN S, CAO F, WANG B

Porous conductive ink used in electroplating pretreatment technology, comprises graphene, conductive particles, binder, hydrophilic oxide, high boiling point solvent and low boiling point solvent.

ZHENG N, SHAO Z, SUN J, WU B

Neodymium-iron-boron plating black zinc and plating layer structure of graphene, has citrate pre-plating nickel layer that is prepared from inside to outside sequentially of substrate, and trivalent chromium black passivation layer.

LUO X, PENG C, GUO C, LAI H

On-site repairing conductive composite plating layer of power equipment involves using electro cleaning solution and silver graphene composite plating solution as electroplating solution and subjecting surface of workpiece to electro cleaning treatment and silver-coated graphene composite treatment.

ZENG X, LIU X, JIA L, TIAN X, PEI F

Preparing resin-based composite material filled with high heat-conducting three-dimensional framework foam useful in displaycard radiating, comprises e.g. copolymerizing three-dimensional framework foam after electro-deposition by resin system by liquid-phase vacuum dipping, solidifying and forming.

LI W, ZHAO Y, WU X, YAN K, XU K, SHI S, WANG Y, JIANG T

Preparing negative charge oxidation graphene, comprises adding concentrated sulfuric acid in reaction container, adding graphite powder, persulfate and phosphorus oxide, and adding concentrated sulfuric acid into graphite solution.

SONG T, CHEN W, PAN Z, LIU Z

Surface treatment for reducing secondary electron yield of oxygen-free copper for e.g. radar, by performing ultrasonic cleaning on oxygen-free copper sheet, performing surface electrolysis treatment in copper sulfate solution, performing electrochemical deposition, and performing heat treatment.

GE Y, FU H, DU Y, PAN P, CAI J, ZHANG H, HAO J

Composite plating layer comprises a silver layer, a silver-graphene layer and a surfactant molecular layer comprising surfactants containing mercapto and/or silicon, imidazoline amphoteric surfactant, sodium lauroyl sarcosinate and sodium lauryl sulfate.

HUANG Y, MA G, HAO W, CHEN Y, ZHANG Q, CHEN B, ZHU Z, DING Y, GUO W, ZHANG C, PANG Z