国家/地区 中国（5）
IPC部 C（5）
IPC大类 C25（5）
IPC小类 C25D（5）
IPC C25D003/38（3） C25D005/54（3） H05K003/42（3）
C25D007/00（2）
发明人 CAO X（2） LU J（2） MA Y（2）
YE G（2） ZHANG J（2） ZHENG K（2）
公开年 2023（5）
申请年 2022（3）  2021（2） 
专利权人 CHINESE ACAD.（2）

Coating solution useful for hole metallization of printed circuit board, comprises edge modified graphene, high molecular polymer, condensing agent, surface energy auxiliary agent, super dispersant, water and pH regulator comprising aqueous ammonia or sodium carbonate solution.

JING W, LI B, LI R, LI F, WU Q, PAN G

Method for preparing high-conductivity nanometer graphene colloid useful in field of printed circuit board involves mixing nano-graphene material with additive, dissolving in water, and performing ball milling and ultrasonic dispersion treatment.

ZHAO Y, CHAI X, HU C, YANG G

Strengthening interfacial bonding force of metal and insulating substrate, comprises e.g. pretreating surface and/or pore structure of insulating substrate, coating prepared graphene dispersion liquid on surface and/or pore structure of charge-adjusted insulating substrate, and drying.

CAO X, YE G, LU J, ZHANG J, MA Y, ZHENG K

Graphene/metal composite layer structure useful in item in electroplating process, preferably used for flexible circuit board, comprises interpenetrating network formed by interlocking electroplated metal and graphene surfaces.

YE G, CAO X, ZHANG J, ZHENG K, LU J, MA Y

Preparing low transmission loss single crystal copper material comprises e.g. forming single crystal copper layer on substrate i.e. graphene layer surface, and peeling off single crystal copper layer from substrate in mixed gas atmosphere of argon and hydrogen.

WANG E, YUE X, HUANG Z, HE M, ZHANG Z, DING Z