国家/地区 韩国（8） 中国（7）
IPC部 B（19）
IPC大类 B29（19）
IPC小类 B29C（16） C08K（15） C08L（9）
C08J（6） B32B（4） C08F（4）
B29B（3） B33Y（3） B82Y（2）
C08G（2）
IPC C08K003/04（13） C08J005/18（5） C08L023/08（4）
B32B027/08（3） B32B027/32（3） B33Y070/10（3）
C08K003/08（3） C08K009/06（3） C08L023/06（3）
C08L023/12（3） B29C035/02（2） B29C043/00（2）
B29C048/00（2） B29C048/40（2） B33Y010/00（2）
发明人 BAI Y（2） CHOI H J（2） GAO D（2）
JEONG S（2） LV Y（2）
公开年 2023（19）
申请年 2021（19）
专利权人 BEIJING RES .（2） CHINA PETROL.（2） JEONG S（2）

Production process of solarization-resistant wine packaging box comprises molding injection-molded plastic wine packaging box for polishing, coating ultraviolet resistance coating, drying, treating, and subjecting plastic wine packaging box for ultraviolet laser printing trademark pattern.

WANG H, MA X

Preparing antistatic composition comprises e.g. adding polymerization solvent, chain transfer agent, alcohol, reaction solvent, borane-terminated polyolefin, hydroxy-terminated polyolefin and reaction solvent, and preparing ionic copolymer.

JEONG S

Manufacturing composite material comprises e.g. preparing foam structure using composite resin containing hexanediol diacrylate and graphene, preparing composite by filling structure with mixture and curing composite.

HOUN K J, CHOI H J

Making carbon carbon composite, carbon ceramic matrix composite, or carbon silica composite, involves making precursor part from resin comprising polyaryletherketone and reinforcing additive, pyrolyzing precursor part, infusing liquid resin into pyrolyzed part, and pyrolyzing infused part.

BARSOTTI R, REBER R, CALVIN M, DI PIETRO S G

Thermoplastic conductive composite material comprises inner layer material comprising fiber bundle, first thermoplastic resin and core layer of first auxiliary agent, and at least one outer layer material covering core layer and is resin layer comprising thermoplastic resin and auxiliary agent.

ZHANG H, LV Y, BAI Y, LI J, CHU L, ZHANG Q, LI C, CAI T, XIN Q, GAO D, KANG P, XU K, SHI S

Electromagnetic shielding polypropylene composite film useful in packaging material field, namely electronic product packaging, comprises e.g. first film layer formed by first polypropylene composition and second film layer formed by second polypropylene composition i.e. resin component.

CHOU B, BAI Y, DONG M, QUAN H, GAO D, XU M, LV Y

Piezoresistive composition used to manufacture piezoresistive composite for three dimensional printing and sensor devices, comprises metal-nanocarbon composite particle, polymer e.g. thermoplastic elastomer and organic solvent.

CHOI H J, LEE M, SONG K, PARK S W

Flexible polymer heat dissipation sheet comprises matrix resin containing nitrile-butadiene rubber, acrylic resin, epoxy resin, phenoxy resin, urethane resin, and/or silicone resin, graphene particles and dispersing agent.

YOO T H, PARK M W, WOO Y H, HWANG S H, HUANG S, YUN H, PARK M, LIU T

Article used in preparing products that can provide anti-bacterial and antifouling properties, comprises glass substrate and lubricating additive, where lubricating additive is deposited over surface of glass substrate forming tribological coating,.

SAHOO S, KHATRI O P, KRISHNAN A N M, GOSVAMI N N

Epoxy molding compound used in fluid ejection device for encapsulating fluidic dies, comprises hardener, inorganic based filler, catalyst to accelerate curing of epoxy molding compound, and conductive additive.

SONG B, ZHANG Z