国家/地区 中国（11）
IPC部 C（11）
IPC大类 H05（11） B32（4） C08（3）
C09（3） C01（2） C25（2）
H01（2）
IPC小类 H05K（11）
IPC H05K009/00（5） B32B027/20（4） H05K007/20（4）
B32B027/06（2） B32B027/32（2） B32B033/00（2）
C08J005/18（2） C08K003/04（2） C08L023/08（2）
C08L023/12（2） C08L023/14（2） C08L023/16（2）
C25D005/54（2）
发明人 BAI Y（3） GAO D（3） LV Y（3）
CAO X（2） CHOU B（2） LIU T（2）
LU J（2） MA Y（2） PARK M（2）
PARK M W（2） QUAN H（2） REN Y（2）
XU K（2） XU M（2） YE G（2）
公开年 2023（11）
申请年 2021（11）
专利权人 BEIJING RES .（3） CHINA PETROL.（3） CHINESE ACAD.（2） HUAWEI TECHN.（2）
INNOX ADVANC.（2）

Low dielectric composite heat dissipation sheet comprises polymer heat radiation sheet layer, first adhesive layer, first ceramic film layer, second adhesive layer, first insulating layer, third adhesive layer, and second insulating layer.

YOO T H, PARK M W, WOO Y H, HWANG S H, HUANG S, YUN H, PARK M, LIU T

Heat dissipation sheet useful for display component comprises heat dissipation layer formed of polymer sheet containing graphene particles, and first adhesive layer located on top of heat dissipation layer.

YOO T H, LEE J, JOH B J, PARK M W, PARK M, CHO B, LIU T

Electromagnetic shielding thermoplastic composite material comprises inner layer material including fiber bundle, first thermoplastics resin and first auxiliary agent, and outer layer material wrapped around core and includes e.g. thermoplastic resin and electromagnetic shielding filler.

REN Y, CHOU B, BAI Y, ZHANG Q, GAO D, ZHANG S, KANG P, XU K, LI C, LV Y

Low-density composite electromagnetic shielding plate used in electronic product comprises electromagnetic wave-absorbing foam layer arranged between two composite shield layers, and composite shielding layer, and glass fiber-reinforced epoxy insulating layer are alternately stacked.

LI H

Magnesium-based composite material useful in structural member of shell of electronic device, comprises magnesium alloy matrix and reinforcing body, where magnesium alloy matrix including e.g. zinc, calcium, aluminum, zirconium, cerium, lanthanum, yttrium, neodymium, silicon, manganese, and tin.

GU L, YING T, HUANG L, ZENG X, WANG R

Antistatic polypropylene composite film useful in packaging materials, comprises at least first film layer formed from a polypropylene composition and second film layer formed from a polypropylene composition.

BAI Y, XU K, CHU L, LV Y, REN Y, GAO D, XU M, QUAN H

Electromagnetic shielding polypropylene composite film useful in field of packaging material, comprises at least one film layer formed from homopolypropylene, propylene impact copolymer and polyolefin elastomer, and at least one film layer formed from e.g. random polypropylene.

CHOU B, BAI Y, DONG M, QUAN H, GAO D, XU M, LV Y

Strengthening interfacial bonding force of metal and insulating substrate, comprises e.g. pretreating surface and/or pore structure of insulating substrate, coating prepared graphene dispersion liquid on surface and/or pore structure of charge-adjusted insulating substrate, and drying.

CAO X, YE G, LU J, ZHANG J, MA Y, ZHENG K

Graphene/metal composite layer structure useful in item in electroplating process, preferably used for flexible circuit board, comprises interpenetrating network formed by interlocking electroplated metal and graphene surfaces.

YE G, CAO X, ZHANG J, ZHENG K, LU J, MA Y

Ultra-thin graphite radiating film for use in electronic device, has release material layer adhered on surface of heat-conducting adhesive layer, where surface of material layer and adhesive layer contact is provided with convex points.

JIANG D, LIU J, ZHOU E