国家/地区 韩国（15）
IPC部 C（15）
IPC大类 C23（15）
IPC小类 C23C（15） C01B（4） C25D（4）
B23K（2） D06M（2） H01B（2）
IPC C23C018/16（15）
发明人 JI W（2） JUNG B M（2） LEE H（2）
LEE J（2） LEE J H（2） LEE K B（2）
LEE S B（2） PARK J（2）
公开年 2021（4） 2022（3）
申请年 2020（6）  2018（3）  2015（2）  2022（2） 
专利权人 SUNGJIN LOGI.（3） KOREA ELECTR.（2） SAMSUNG ELEC.（2）

Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.

CHU K, LEE J, JUNGHOON L, CHU K M

Manufacture of wire for coaxial cable, involves forming plating layer by plating etched-surface core layer made of aramid fibers, palladium metallizing, forming graphene oxide layer and another plating layer on graphene coating layer and forming antioxidant layer.

PARK J, TAE K

Carbon metal nanocomposite comprises a plate-shaped carbon nanomaterial, a first metal layer formed on the plate-shape carbon nano-material, and a second metal layer provided on the first metallic layer.

LEE C S, PARK J, JEON Y, SONGYI H

Plated molded product comprises molded thermoplastic resin composition and electrolytic plating layer formed on surface, where thermoplastic resin composition is styrene-based resin and additive for shortening plating.

HAN S, KANG B I, LEE J H, KIM S K

Electroless plating method comprises injection molding synthetic resin material, immersing in degreasing solution containing triethanolamine and sulfuric acid and immersing in pre-etching solution containing 1,2-dimethoxypropane.

JI M G, KIM W K, SUK P S, CHAYOUNBONG

Electroless plating comprises injection molding synthetic resin material, physically etching, degreasing by immersing resin material in degreasing solution containing monomethanolamine, and pre-etching using 1,2-dimethoxypropane.

JI W

Electroless plating of synthetic resin material used as lighting components, involves degreasing injection-molded synthetic resin material in degreasing solution, chemically etching, neutralizing, and forming nickel and copper plated layers.

JI W

Composition useful for catalyst-free electroless plating, comprises metal precursors including nickel precursor, and iron precursors, cobalt precursors and/or copper precursors, reducing agent, and plated object.

KIM T, LEE K B, LEE S B, JUNG B M

Manufacture of antibacterial filter for mask, involves impregnating graphene slurry comprising graphene and silver nanoparticles into polymer fibers, and immersing graphene-impregnated polymer fibers in silver electroless plating solution.

LEE G

Patterning metal on graphene oxide material surface, comprises irradiating surface of graphene oxide material with laser to reduce laser irradiated graphene oxide surface portion, and plating reduced graphene oxide surface with metal.

PARK S Y, SU Y C, YANG J U, CHO Y J, CHO K