国家/地区 中国（7）
IPC部 B（7）
IPC大类 B32（7）
IPC小类 B32B（7） F28D（2） H05K（2）
IPC B32B003/26（7）
发明人
公开年 2021（3） 2022（3）
申请年 2021（4）  2020（2） 
专利权人

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Heat dissipation sheet comprises e.g. graphite layer, primary graphene layer stacked on one side of graphite layer with primary adhesive layer interposed there between and secondary graphene layer stacked with secondary adhesive layer.

PARK J, YOUNG C, CHOI C Y, PARK J U, CHOI C, PIAO Z

Heat storage ceramic tile, has ceramic tile main body whose top part is provided with ceramic surface skid-proof layer, and heat storage layer whose inner part provided with thermocouple and other side provided with telescopic hole.

WANG Y, ZHANG H, SHENG Y

Sealing pad of composite cylinder cover for sealing between cylinder cover and cylinder housing, has core plate and composite material plate that are formed with sealing weld bead at boundary position.

LUO Z

Fabric structure for garments for use in hot weather or for sporting use, comprises first layer comprising fibers of heat-conducting material, second layer having preferential passages for sweat in vapor phase, and third layer.

POLEGATO MORETTI M, BRUNO M, MARCON C, POLONI L, POLEGATO M M

Preparing trenchless construction reinforced wear-resistant polyethylene gas pipe, comprises e.g. extruding block copolymer polypropylene, graphene black masterbatch, polyethylene resin and polyethylene graft resin, cooling, and shaping.

LIU J, FU Y, MEI L, TENG X, LIU W, WAN G, TIAN X

Enhanced heat dissipation composite structure, comprises graphene film and metal layer deposited on upper surface of graphene film, where graphene film and metal layer are provided with array via holes.

FAN D, WANG J, LI Q