国家/地区 美国（6）
IPC部 F（6）
IPC大类 F28（6） G06（6） H01（5）
H05（5）
IPC小类 G06F（6） H01L（5） H05K（5）
F28F（4） F28D（3）
IPC G06F001/20（6）
发明人
公开年 2021（3）
申请年 2020（2） 
专利权人

Heat conductive device for use in an electronic device, such as mobile phones, comprises a heat conductive unit provided with a closed chamber, a wick structure arranged on an inner side surface of the closed chamber, and a heat conductive fluid is arranged in the closed chamber.

CHENG C, WEI S, JUANG Z, HSIEH C

Thermal exchange assembly used e.g. in computing platform e.g. laptop, comprises cold plate configured to be placed on semiconductor device and including window section, and heat pipe directly coupled to cold plate and including window.

CARBONE M, HUTTULA J, MISHRA C, PAAVOLA J

Heat dissipating device, disposed on circuit board, comprises first glue layer, disposed on circuit board, first graphene composite heat dissipating layer, second glue layer, second graphene composite heat dissipating layer, and resin layer.

CHANG C F

Computing device comprises a set of components that includes a conductive sheet, which is provided with first graphene layer to dissipate a portion of heat, and second graphene layer that is used as an electrical ground.

MORRISON J T, FILES J W, NORTH T C

Graphene-based heat dissipation system for e.g. portable microelectronic device, has heat-conducting layer comprising sheet of integrated graphene film, which shields component or external surface of electronic device from heat.

ZHAMU A, WANG M, XIONG W, JANG B Z

Thermal management assembly for e.g. fuel cells, comprises heat sink including graphite layer (exhibiting thermal conductivity, which is anisotropic in nature) obtained by cleaving graphene layer from graphite sheet, and support layer.

SAYIR H, MEHMET A, COOPER E B, ICOZ T, SCHAEPKENS M, LIU X