国家/地区 中国（17） 美国（6） 韩国（4） 欧洲专利局（EPO）（3） 世界知识产权组织（3） 印度（2） 台湾（2）
IPC部 F（28）
IPC大类 F28（28） H01（9） H05（6）
G06（5） C01（3） H02（3）
B32（2） F24（2） F25（2）
IPC小类 F28D（28）
IPC F28D015/02（28）
发明人 LU J（2） ZHENG Z（2） ZHONG M（2）
公开年 2021（9） 2022（5） 2020（4） 2023（4） 2017（3） 2018（2）
申请年 2020（6）  2021（6）  2022（6）  2016（3）  2019（3）  2017（2） 
专利权人 LAUREL ELECT.（2）

Extrusion type heat distribution pipe, has heat pipe provided with radiating fin, and squeezing type base composed of pure aluminum shell and high heat-conducting supporting conductive structure.

LU B

Vapor chamber for use in e.g. electronic device, has sealing parts formed along edges of opposite surfaces of upper and lower plates, and porous metal fiber sheet provided between upper plate and lower plate and filled with low boiling point fluorohydrocarbon.

HUN L S, KIMTAEHAN

Boiling device with crack-shaped quantum graphene film as substrate, has boiling radiating system supported by supporting column, and condenser is connected with first side end of boiling cavity through liquid flow pipe.

TAO P, SHANG W, SONG C, DENG T, FU B, CHU B

Hybrid battery thermal management system for electric vehicle such as electric car or any hybrid vehicle, comprises nano enhanced phase changing material, which stores heat generated by battery and dissipates it into environment, heat pipes comprising nano fluids and equipped with circular fins.

JOSHI A K, KAKATI P, DANDOTIYA D S

Uniform temperature device, has base plate comprising first surface and second surface opposite to first surface, heat conducting piece arranged on first surface of substrate, and radiation layer arranged on second surface.

ZHONG M, ZHENG Z

Uniform temperature device i.e. stacked uniform temperature equalizing device, has set of heat conducting pieces arranged on first surface of base plate, and radiation layer arranged on second surface of plate.

ZHONG M, ZHENG Z

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Temperature equalizing device for enabling heat source to achieve uniform heat dissipation, has radiation layer that is arranged on second surface of substrate.

CHENG C, CHUNG M H

Thermal management device for electronic device, has bracket that is provided with clamping portion that holds heat pipe by side exterior surfaces of heat pipe, and that does not extend past first exterior surface of pipe.

HUANG H, WU K, CHANG C H

Semi-modular energy-saving graphene floor heating, has connecting spring whose upper and lower ends are connected with sliding rod, where end parts of two groups of sliding rods are correspondingly provided with clamping hook clamped in substrate.

YANG Y