国家/地区 台湾（8）
IPC部 C（8）
IPC大类 C08（8）
IPC小类 C08L（8）
IPC C08K003/04（6） C08L023/08（3） C08L075/04（3）
C09K003/10（3） C08K005/00（2） C08L029/04（2）
C08L063/00（2） C08L079/08（2） C08L101/00（2）
C09D201/00（2） G02F001/1339（2） G02F001/167（2）
G02F001/1679（2） H01B001/22（2） H01B001/24（2）
发明人 BERHANE A（2） PARENT M E（2） SARVI A（2）
公开年 2022（4）
申请年 2022（4）  2020（2） 
专利权人 E INK CALIFO.（2） EINK CORP（2）

Water absorbing, electrically conductive composition used as sensor for erosion and/or corrosion monitoring, comprises water soluble and/or water swellable and/or water absorbing resin, electrically conductive filler, and solvent.

TATHE D, SHAH J P

Curable resin composition used in adhesive for optical light receiving and emitting modules, sealing agent for optical light emitting/receiving module, and optical light emitting/receiving module member, comprises epoxy resin, carbon material having graphene laminated structure, and resin.

SUEMATSU M, URAYAMA T, ENAMI T, SATO K

Aqueous sealing layer for sealing microcells of electro-optic devices, comprises water soluble poly(vinylalcohol) homopolymer or poly(vinyl alcohol-co-ethylene) copolymer, and polyurethane.

SARVI A, BERHANE A, AZAGARSAMY M A, PARENT M E, AZAGARSAMY M

Sealing layers for sealing microcells of electro-optic devices, such as electrophoretic displays, comprises water soluble poly(vinyl alcohol) homopolymer or poly(vinyl alcohol-co-ethylene) copolymer by weight of sealing layer, polyurethane, conductive filler, such as carbon black, graphene, graphite.

TELFER S J, CROUNSE K R, PARENT M E, BERHANE A, SARVI A

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S

Composition used in forming thin film, comprises chemical contrast pattern having first region of first chemistry on background of second chemistry, and microphase-separated block copolymer material overlying the chemical contrast pattern.

ARNOLD M, JACOBBERGER R, NEALEY P, XIONG S, CHANG T, MA Z, NEALEY P F

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Electrically insulating and thermally conductive composition useful in electronic device e.g. computer, comprises resin, electrically insulating and thermally conductive powder, and graphene in specific amounts.

LIN C, WU M, CHIOU K, LIN C L, WU M J, CHIOU K C, LIN Z, QIU G