国家/地区 中国（4） 美国（4） 世界知识产权组织（4） 欧洲专利局（EPO）（3） 韩国（3） 印度（2） 日本（2）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08K（5） H05K（4） C08L（3）
C09K（3） B32B（2） C09D（2）
H01L（2）
IPC C08K007/06（5）
发明人
公开年 2021（5）
申请年 2020（2）  2021（2） 
专利权人

Preparation of heat conducting gasket used for electronic products by mixing phase change material, heat conducting filler, matrix material and crosslinking agent, performing curing crosslinking reaction, and freezing preform.

CHU W, JIANG N, LI M, YU J

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Integrating process of electrically conductive material into surface layer of electrically conductive polymer, involves including an electrically conductive material in a polymerisation mixture, and polymerising polymerisation mixture.

HIGHGATE D J, HOWLIN B J, TANG W

Heat-dissipating plastic used for e.g. electronic component, comprises polymer matrix including main resin, and carbon-based filler including fibrous carbon-based filler and granular carbon-based filler, dispersed in polymer matrix.

LEE J H, LI Z

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E