国家/地区 韩国（6）
IPC部 C（6）
IPC大类 C09（6） H05（5） C01（3）
C08（2）
IPC小类 C09J（6）
IPC H05K007/20（5） C09J011/04（4） C09J007/20（3）
C09J201/00（3） C01B032/19（2） C01B032/21（2）
C08K003/04（2） C09J007/28（2）
发明人 CHOI S（3） SONG J（3） YUMINSOOK（3）
HUN L S（2） KIMTAEHAN（2） KWON H J（2）
SHIM Y（2） YOUK S K（2）
公开年 2023（6）
申请年 2021（6） 
专利权人 PURE MANN IN.（3）

New fluorinated carbonotrithioic acid based binder compounds useful in conductive adhesive of anode sheet to produce secondary battery for battery module of battery pack used in electrical device.

ZHANG M, ZHAO Y, LIN J, LI X, JIN H, YANJI J, JIANGHUI L, ZHU J H

Manufacturing heat dissipation sheet using graphene useful for electric or electromagnetic devices comprises preparing dispersion having graphene or graphene oxide, adsorbing metal salt to graphene or graphene oxide by adding metal salt.

JIN K

Heat dissipation adhesive sheet comprises copper graphene composite sheet filled with crude graphene solution, where crude graphene solution is coated on copper mesh and graphene resin layer formed on graphene composite sheet.

HEE L J, HEE L Y, CHOIJINHO

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Heat dissipation graphite sheet useful in producing mobile phones and thin portable products comprise heat dissipation layer containing urethane resin, and expanded graphite particles applied to one surface of graphite layer.

KIMTAEHAN, KWON H J, CHOI S, SHIM Y, SONG J, YUMINSOOK

Electromagnetic wave shield heat dissipation adhesive sheet useful for electrical and electronic devices e.g. semiconductor chips, and chargers comprises heat dissipation layer, electromagnetic wave shielding layer and adhesive layer.

KIMTAEHAN, HUN L S, SONG J, CHOI S, YUMINSOOK, YOUK S K, SHIM Y