国家/地区 美国（3） 中国（2） 韩国（2）
IPC部 B（6）
IPC大类 B23（6）
IPC小类 C23C（6）
IPC B23B027/14（2）
发明人
公开年 2023（6）
申请年 2022（6）
专利权人 SAMSUNG ELEC.（2）

Preparing copper-clad aluminum composite welding strip used in interconnection strip, bus belt comprises surface cleaning of copper strip and aluminum rod, wrapping, multiple drawing of composite copper rod, and ultrasonic testing, drawing composite copper wire, heat annealing and tin plating.

DONG W, ZHANG W, GAO L, CHEN Q

Chuck assembly used in semiconductor device fabrication system, comprises chuck base includes lower base and upper base that is on lower base, ceramic plate on upper base, and isolator ring enclosing outer sidewall of lower base.

JUNG U, SHIN M, SUNG D, NA D, KIM D, KIM K, JEONG S, JUNG S H, KIMKYUNGSUN, KIM D W, SUNG D Y, SU S M, JUNGUNGYO

Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.

CHU K, LEE J, JUNGHOON L, CHU K M

Manufacturing additive layer used for making particulate and particulate feedstock, involves receiving particulate at chemical vapor deposition reactor, flowing hydrocarbon gas into CVD reactor, decomposing hydrocarbon gas in CVD reactor, depositing carbonaceous coating on particulate.

SCHMIDT W R, ELWARDANY T I, SHE Y, SHARON J A

Machining of titanium alloy with micro-groove textured cutting tool has different type of tool inserts like plain tool, triangle micro texture tool and triangle texture tool with solid lubricant using tungsten carbide chemical vapor deposition coated insert.

KAUR H, BALA A, SETHI G, CHAWLA K, BAHL A, SINGH J, PRADHAN S, SOPPA I

Material alloy cutter comprises base material layer and carburized layer, where carburized layer is arranged on surface of base material layer, and titanium-aluminum-silicon-nitrogen composite coating of graphene doping is deposited outside carburized layer.

ZHU X, YANG Z, YANG Y, LIU H, LING X