国家/地区 日本（254）
IPC部 B（254）
IPC大类 B32（254）
IPC小类 B32B（254）
IPC B32B009/00（119） C01B031/02（101） C01B031/04（63）
B82Y030/00（59） B82Y040/00（48） C08K003/04（35）
C23C016/26（32） H01B013/00（31） B32B009/04（30）
H01B005/14（29） B32B027/30（28） C01B032/194（26）
H01B001/04（25） C01B032/182（23） B32B027/18（22）
发明人 JIANG K（10） FAN S（9） KIMURA N（7）
SHIMIZU K（7） TATENO Y（7） CHOI J（6）
FAN F Y（6） HASEGAWA M（5） KIM J（5）
KOBAYASHI T（5） LIN X（5） MIHASHI F（5）
SUEMITSU M（5） YAMADA T（5） ADACHI M（4）
公开年 2021（53） 2012（27） 2013（22） 2014（21） 2017（20） 2015（19） 2011（18） 2022（17） 2016（11） 2009（9） 2010（9） 2018（8） 2020（6） 2023（6） 2003（2） 2008（2）
申请年 2020（32）  2012（31）  2013（24）  2021（24）  2011（23）  2019（17）  2016（15）  2014（14）  2009（13）  2015（13）  2017（13）  2010（12）  2022（7）  2008（6）  2002（3）  2007（3）  2018（3） 
专利权人 HON HAI PREC.（10） HONGFUJIN PR.（10） UNIV TSINGHU.（10） SONY CORP（8）
SUMITOMO ELE.（8） NAT INST ADV.（7） SAMSUNG ELEC.（6） SEKISUI CHEM.（6）
MITSUBISHI M.（5） SEKISUI CHEM.（5） UNIV TOHOKU（5） FUJI ELECTRI.（4）
OIKE KOGYO K.（4） SAMSUNG ELEC.（4） SEMICONDUCTO.（4） COMMISSARIAT.（3）
DOKURITSU GY.（3） GRAPHENE SQU.（3） HANKOOK ALUM.（3） JX NIPPON MI.（3）

Crystalline carbon substrate material has surface that is flattened by forming single layer or multiple layers of metal film having thickness of 100 nm or more on substrate surface by vacuum film forming process and hot-pressing entire surface in vicinity of melting point of metal film.

HIRAI A

Powder coating composition used for forming film used as surface layer for laminate and coated article, comprises fluorine-containing ethylenic polymer, and conductive material which is at least partially carbon nanotubes.

HONDA A, IMADA H, MIYATANI T, NAKATANI Y, HONDA Y

Producing food packaging barrier film used for consumers to clearly see content of packaged goods, involves providing base film, depositing inorganic laminated film on surface of base film, where inorganic laminated film includes at least one first and second inorganic material deposition layer.

CHEN C, TSAO C, LIAO T, LIAO T C, TSAO C C, CHEN C H, CHEN Z, CAO J, LIAO D

Electronic component package, comprises polymeric core comprising first polymeric material and an outer overmold layer comprising second polymeric material containing graphene, outer overmold layer defining a case skin disposed on polymeric core,where first and second polymeric are thermoplastic.

NARITA M, SARANG S, KHAN S

Coating substrate by depositing a conductive layer comprising electrically conductive material over substrate, where conductive layer has specific resistivity, and depositing anti-icing layer comprising nanomaterials over conductive layer to form coating system.

KINLEN P J, PRIFTIS D

Heat dissipation component used for e.g. battery, comprises substrate comprising metal, and composite material comprising multilayer graphene layer in which two or more layers of graphene are laminated, and amorphous carbon wall portion adhered to graphene layer in circumferential direction.

WATANABE J

Separation membrane used for separating substances from mixed liquids and gases for dehydration, has porous support, and separation layer formed on porous support and containing nanomaterial and organosilica having silsesquioxane structure.

TSURU T, KANESASHI M, NAGASAWA H

Metal-graphene composite comprises metal layer and graphene layer provided by growing directly on one surface of metal layer, where graphene layer contains two and/or more graphene thin, metal layer is copper, nickel, cobalt, iron, manganese, chromium, vanadium, titanium, platinum, gold and aluminum.

KIM D J, HONG B H, WOO Y S, KIM D, YU Y S

Graphene laminate comprises substrate having insulating surface, intermediate layer located on and in contact with substrate, and graphene film located on intermediate layer and in contact with intermediate layer.

OKIGAWA Y, YAMADA T

Separation membrane has support having water permeability, matrix layer supported by support and having holes, and graphene layer including graphene material supported by matrix layer and including graphene and/or graphene oxide, and having another holes overlapping holes.

HIROTAKA S, YASUHIKO T, MOTOYUKI H, MASASHI M, SAKUMA H, TADA Y, HIROOKA M, MARUYAMA M