国家/地区 美国（9）
IPC部 C（9） B（5） H（2）
IPC大类 C08（9）
IPC小类 C08K（9） C08L（7） C08G（4）
C09K（4） C08J（3） B33Y（2）
B82Y（2） C01B（2） C07D（2）
C08F（2） C09D（2）
IPC C08K003/04（9）
发明人 WANG Y（2）
公开年 2021（5） 2022（3）
申请年 2021（9）
专利权人 AORUILONG NE.（2） HT MATERIALS.（2） WANG Y（2）

Thermally conductive material comprises base polymer, ethylene methyl acetate, graphite fibers and bis(2-ethylhexyl) adipate.

PARE R, KAMAVARAM V

Composition comprises poly(arylene ether), where poly(arylene ether) is polymeric reaction product of one disubstituted benzophenone and polyol and one polyol comprises one fluorinated diol.

CONNELL J W, BELCHER M A, GHOSE S

Carbon material dispersion liquid used for manufacturing e.g. paints, comprises carbon material containing carbon black, organic solvent, and polymer dispersant comprising amine-containing structural unit, propanone-containing structural unit, and other structural units connected to these units.

HIROYUKI S, YOSHIKAZU M, JUN K, SEIJI D, SHIMANAKA H, MURAKAMI Y, KAMABAYASHI J, DOI S

Semicrystalline poly(aryl ether ketone) copolymer compositions are used in high pressure and high temperature environment, comprises copolymer having two separate recurring units, first recurring unit and second recurring unit.

WANG Y

Polymeric composition used in article of manufacture, comprises copolymer with recurring unit containing 1-methyl-3-(4-(4-methyl-benzoyl)-phenyl)-1,3-dihydro-benzoimidazol-2-one having compound and recurring unit containing (4-(4-hydroxy-phenoxy)-phenyl)-phenyl-methanone having compound.

WANG Y

Component e.g. cross component e.g. cross beam of vehicle, comprises polymeric material, carbonaceous filler dispersed in polymeric material, and filler comprising substrate, and carbon nanotubes extending from surface of substrate.

BUDAJ J, BUSUIOC D, GALL R, DELLOCK P K, SALTER S C, RICHARD G

Conductive composite resin composition for photocurable three-dimensional printed material, comprises photoreactive viscosity decreasing agent, photocurable resin and conductive nanostructures, and has specified viscosity.

LEE H, KIM S, KIM S W, SANGHYE K, CHUN D

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Dispersion useful for manufacturing additive for encapsulating electronic components, comprises portion of cross-linkable moiety, and oxidized discrete carbon nanotubes with bonded dispersing agent.

IVANOVA O, LOWDER S, SWOGGER K W, BOSNYAK C P