国家/地区 中国（6）
IPC部 C（6） H（4） B（2）
IPC大类 C08（6）
IPC小类 C08K（6）
IPC C08K003/04（5） C08K003/013（3） C01B032/194（2）
C08K003/22（2） C08K007/06（2） C09K005/14（2）
H01L023/36（2）
发明人
公开年 2021（4） 2022（2）
申请年 2021（6）
专利权人

Carbon material dispersion liquid used for manufacturing e.g. paints, comprises carbon material containing carbon black, organic solvent, and polymer dispersant comprising amine-containing structural unit, propanone-containing structural unit, and other structural units connected to these units.

HIROYUKI S, YOSHIKAZU M, JUN K, SEIJI D, SHIMANAKA H, MURAKAMI Y, KAMABAYASHI J, DOI S

Heat-conductive silicone heat radiation material used as thermal interface material between heating portion of electronic component and heat sink comprises silicone polymer, heat-conductive inorganic filler, and heat-resistance improver.

KOBAYASHI S, KIMURA Y, SHINGO K, YUKO K

Flowable hardenable composition used in electronic heat sink assembly, comprises shaped composite particles, having thermal filler particles having specific aspect ratio retained in binder matrix, dispersed in hardenable binder precursor.

PEREZ M A, MARTINEZ J A

Composition for coating and for forming a coating on substrate e.g., surface of boat or ship comprises epoxy-functional monomers, diluent, and sufficient amount of hydrophobicity-modifying additive that is reactive in epoxide polymerization.

GAIER M, ALGERMOZI M, RODIONOV I

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Hollow particles used for heat-dissipation fluid composition, comprise inorganic particle layer comprising ceramic particles and conductive carbon-based particles as spherical hollow particles and having empty inner space inside, and polymer coating layer.

KWON K A, CHUN M S, KIM D Y, SEOK C M, KIM D, QUAN W, QUAN J