国家/地区 中国（6）
IPC部 C（6）
IPC大类 C08（6）
IPC小类 C08K（6） C08L（5） C09K（3）
C08J（2）
IPC C08K007/24（6）
发明人 DING S（3） LIU Z（3） MA J（3）
ZHOU X（3）
公开年
申请年 2015（3）  2021（2） 
专利权人 NINGBO INST MATERIALS TECHNOLOGY ENG C（6）

Thermal interface material useful for electronic packaging material, comprises three-dimensional graphene skeleton including graphene sheets.

JIANG N, TAN X, DAI W, LIN Z, LV L

Preparing thermally conductive composite material useful in radiating field of electronic device, comprises e.g. obtaining three-dimensional porous graphene by laser processing polybenzoxazine resin, casting polymer fluid, and curing.

ZHAO W, LIU X, YU W, JIANG Y

Thermally conductive three-dimensional (3D) graphene-polymer composite material used in electronic device, comprises porous 3D graphene structure comprising network of graphene layers attached to one another and polymer material.

ODEH I N, ZHOU X, MA J, DING S, LIU Y, LIU Z

Preparation of graphene-based thermally conductive silica gel, involves immersing surface-modified organic porous polymer in graphene slurry, sintering to obtain porous composite material, mixing with silica gel and curing.

MA J, ZHOU X, LIU Z, DING S, LIU D

Graphene-based heat conduction silica gel phase change composite material comprises silicon substrate, and heat conduction phase change material, which is dispersed in silicon substrate and contains heat conductive filler.

DING S, LIU Z, ZHOU X, MA J

Partially reduced graphene-containing polymer composite functional fiber comprises component containing partially reduced graphene-polyester and component containing nanocomposite filler-polyester which are combined in sheath-core type.

CHEN P, HONG L