国家/地区 世界知识产权组织（20）
IPC部 C（20） H（5） B（4）
A（2）
IPC大类 C08（20）
IPC小类 C08K（20） C08L（11） C09K（10）
C08J（9） C01B（4） H01B（3）
B82Y（2） C08F（2） C08G（2）
H05K（2）
IPC C08K003/38（20）
发明人 ALSHARAEH E（2） LEE E J（2） LEE K（2）
LEE K D（2） LOSIC D（2） NAM C R（2）
NINE M J（2） SEO M K（2） SONG J（2）
SONG J H（2） TRAN D N H（2）
公开年 2021（11） 2022（3） 2023（3） 2018（2）
申请年 2020（7）  2022（5）  2021（4）  2017（2） 
专利权人 3M INNOVATIV.（2） CHINESE ACAD.（2） HANSOL CHEM .（2） SAUDI ARABIA.（2）
UNIV ADELAID.（2）

Composite used for solar thermal collector and heat exchanger, comprises polymer matrix, graphene and at least one thermally conductive inorganic filler, and graphene and thermally conductive inorganic filler are dispersed within polymer matrix.

BOYLE C, STRAIN F, MCGONIGLE N, MCNALLY T, KUMAR S

Heat dissipation composite composition used for forming heat dissipation composite, comprises epoxy resin, and phase change material, and includes polymer matrix formed by chemical bonding of epoxy resin and phase change material.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Manufacturing heat dissipation composite by melting and stirring epoxy resin, phase change material, and curing agent, curing at temperature higher than curing temperature of epoxy resin to form matrix, and simultaneously performing secondary main curing and high-density compression processing.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Thermally conductive, electrically insulating film used in electronic products and devices, comprises thermoplastic resin, and thermally conductive filler comprising thermally conductive carbon-based filler, thermally conductive metal oxide or hydroxide filler and thermally conductive ceramic filler.

MENG F

One-component thermal-gel composition used for heat dissipating material for dissipating heat from substrate, comprises crosslinkable organopolysiloxane, hydrolyzable organopolysiloxane, thermal conductivity enhancing agent, organopolysiloxane, adhesion promoter, antioxidant, and pigment.

DUTTA P, DASGUPTA D, MS A, FUJIMOTO T, CHISATO H, ANJITHA M, HOSHINO C

Adhesive film for producing structure e.g. heat-dissipating substrate, is formed of adhesive resin composition that contains thermally conductive filler composed of at least one of graphene having two-dimensional structure and single-walled boron nitride, thermosetting component and binder polymer.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Preparing recyclable nano composite material comprises providing reinforcement material including conductive material or conductive material and insulating material and compounding reinforcement material and the base material, where conductive material includes e.g. carbon nanotube and graphene.

QU S, XI J, LV W

Phthalonitrile composite material for heat conduction and insulation fields, involves heat conducting filler distributed in phthalonitrile matrix resin or heat conducting filler layer partially covered on phthalonitrile micro-sphere surface.

ZHOU H, GUO Y, ZHAO T, LIU X, DING J, ZHAO Z

Preparing polymer composite involves dispersing nanosheet filler within polymer matrix by dissolving monomer in water to form first solution, dispersing nanosheet filler in organic solvent in the presence of emulsifying agent.

MICHAEL F M, ALSHARAEH E, ALMOHSIN A

Preparing elastomer filled conductive 2-dimentional (2D) nanoparticles involves blending elastomer polymer precursor and layered material to get conductive nanoparticle-filled polymer precursor and mixing with elastomer polymer curing agent.

LYNCHBRANZOI J K, ASHRAF A