国家/地区 中国（13）
IPC部 C（13）
IPC大类 C08（13）
IPC小类 C08G（13）
IPC C08L063/00（13）
发明人 LIU L（2） LIU S（2） XU Y（2）
XUE Z（2） ZHANG Y（2）
公开年 2018（13）
申请年 2018（7）  2017（5） 
专利权人 CHANGZHOU BA.（2）

Composite material contains epoxy resin, butadiene rubber, terminal carboxylated nitrile rubber, stearic acid, sulfur, N-cyclohexyl-2-benzothiazolesulfenamide, nano titanium dioxide, graphene oxide, and hexaphenoxycyclotriphosphazene.

LI X

Graphene-based PCB copper-clad plate, comprises copper-clad laminate prepreg, copper foil and prepreg, and a layer of chemical vapor deposited graphene between copper foils.

ZHANG J, ZHANG Y, XU Y, FENG S, WANG Q

Preparing graphene toughened resin-based carbon fiber composite material comprises e.g. ultrasonically dispersing graphene and the low-viscosity reactive dispersant, mixing dispersion with resin, drying, pressing and curing.

LIU L, LI A, PENG Y, ZHANG F, ZHANG Y, SHI L

Preparing graphene-doped fluorine-containing silicon acrylate polymer packaging material comprises e.g. adding nonylphenol ethoxylate into deionized water, heating, dispersing, removing emulsion and vacuum defoaming.

CHE C

Boron nitride-coated sulfonated graphene-epoxy resin composite material for electronic packaging materials, comprises epoxy resin powder, boron nitride powder, sulfonated graphene powder, silane coupling agents, and polyamide curing agent.

CHEN Q, DING X, NI R, DUAN M, LI H

Preparation of flame retardant graphene-modified epoxy resin nanocomposite material by preparing graphene oxide, preparing cage-like octa(3-aminopropyl)silsesquioxane, and preparing functionalized graphene; and graphene-modified epoxy resin.

ZUO D, LIU H, XU X

Silicone epoxy resin composition comprises epoxy-modified silicone oil, bisphenol-A type epoxy resin, epoxy resin curing agent, transparent glass particles, hydrophobic fumed silica and graphene powder.

LIU S

New phosphorus-nitrogen-containing silicon polymer modified graphene oxide flame retardant.

DAI L, LI M, WANG S, HONG J, LIU L, XU Y, YUAN C, CHEN G, ZENG B, LUO W

Low-temperature resistant epoxy resin material comprises epoxy resin, phthalazinone poly(aryl ether sulfone), graphene and curing agent.

LIU S, ZHANG T, CHEN L, JI P, WANG G

Preparing graphene/epoxy resin composite polymer material, comprises e.g. mixing 3-mercaptopropionic acid, pentaerythritol, p-toluenesulfonic acid and toluene and placing in a three-necked flask to refluxing and filtering.

XUE Z