国家/地区 中国（41） 韩国（6） 台湾（6） 美国（6） 世界知识产权组织（6） 日本（5） 欧洲专利局（EPO）（2）
IPC部 C（45） H（45） B（7）
D（2） F（2）
IPC大类 C08（45）
IPC小类 C08L（45）
IPC C08L063/00（45）
发明人 GU J（3） LIANG C（3） WANG J（3）
CHEN C（2） CHEN K（2） CHI S（2）
HE J（2） HUANGFU Y（2） JI S Y（2）
KIM S（2） KIM S H（2） LI M（2）
LIU C（2） LIU J（2） MA H（2）
公开年 2018（9） 2021（9） 2022（8） 2023（8） 2020（3） 2012（2） 2013（2） 2019（2）
申请年 2021（9）  2022（9）  2020（7）  2019（5）  2017（4）  2018（4）  2011（2）  2013（2） 
专利权人 SAMSUNG ELEC.（3） UNIV NORTHWE.（3） CHANGSHU SHE.（2） ITEQ WUXI EL.（2）
KYOCERA CORP（2） SHENGYI TECH.（2）

Electromagnetic interference suppressing material used as radio wave absorber, noise suppression sheet, semiconductor sealing material, sealing sheet, and wire coating material, comprises base material containing organic substances and inorganic substances, and powdered carbon material.

NISHIHARA H, YOSHIDA S, UCHIDA K

Resin composition used for preparing low-flow glue prepreg for rigid-flexible combined printed circuit board, comprises epoxy resin, epoxy curing agent, curing accelerator, carboxy-terminated nitrile rubber, and oxazoline compound.

ZHANG W, CHEN C, HE J

Resin composition useful in preparing low-flow adhesive prepreg comprises epoxy resin, epoxy curing agent, curing accelerator, carboxylated nitrile rubber, carbodiimide compound.

ZHANG W, CHEN C, HE J

Preparing electromagnetic shielding carbon fiber fabric composite material based on reduced graphene oxide reinforcement useful for e.g. military anti-radar radome, comprises making reduced sample into electromagnetic shielding carbon fiber fabric composite material.

DAI M, HONG X

Preparation of graphene oxide thermally conductive film by dispersing graphene oxide, nanocellulose and polysorbate 20 in deionized water, adding aqueous-based epoxy resin and curing agent to disperse, forming layer of graphene oxide, and coating slurry gel system thermally conductive film.

CHEN D

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Foam electromagnetic shielding material with bulletproof function used in stealth airplanes, is prepared by superposing coated aramid fiber laid fabric blocks to obtain bulletproof aramid fiber chips to obtain foam electromagnetic shielding material precursor, and heating.

FU L, PAN Z, WU Z, LIU Y, FANG X, CUI Z, LI Z, XU D, AI Q, HU L, LI N, CHEN H

Preparing structure or electromagnetic shielding integrated hybrid composite material involves using high quality graphene network as basic building unit, growing zinc oxide nanowire on surface, and obtaining zinc oxide or graphene three-dimensional network hybrid composite material.

CHENG H, LIU C, ZENG Y, LI M, SUN X, ZHANG J, MA Y, WANG H

Epoxy resin composite material, has multiple fluorinated graphene films located in epoxy resin base body, where multiple fluorinated graphene films orderly arranged along thickness direction and along length direction of epoxy resin base body.

PAN Z, ZHOU M

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D