国家/地区 中国（12） 世界知识产权组织（2）
IPC部 C（14） B（4）
IPC大类 C08（14）
IPC小类 C08L（14）
IPC C08L063/00（14）
发明人 LI W（2）
公开年 2021（14）
申请年 2020（9）  2019（3）  2021（2） 
专利权人

Preparing heat-conducting engineering plastic involves carboxylation treatment, pretreatment, sintering, ionization, drying, ball milling, hydrogel preparation, aerogel preparation and finished products.

GAO X

Manufacture of fluorescent epoxy transparent wood involves treating wood with treatment solution containing sulfite and treatment solution comprising hydrogen peroxide, impregnating with epoxy resin composition comprising quantum dots, and curing composition.

SONG S, LEE C K

Preparing thermally conductive composite material useful in radiating field of electronic device, comprises e.g. obtaining three-dimensional porous graphene by laser processing polybenzoxazine resin, casting polymer fluid, and curing.

ZHAO W, LIU X, YU W, JIANG Y

Preparing thermally conductive polymer composite material with multi-level continuous network structure by preparing network , soaking in dispersion, drying, soaking in polymer aqueous solution or polymer precursor solution, and drying.

QIN M, CHEN L

High thermal conductivity carbon fiber composite material with laminated hybrid structure comprises combination of carbon fiber cloth layer, sheet filler thermal conductivity network, and sheet sandwich ball laminated structure.

WANG H, SUN X, ZHANG J, MA C, LU N, ZENG Y, REN W, LIU C, CHENG H

Preparing heat-conductive filler three-dimensional framework comprises e.g. mixing aqueous graphene oxide dispersion with thermally conductive filler, adding reducing agent and surfactant, stirring, then sealing, drying and heat-treating.

LU Y, LI J, LIN Y, ZHANG C, XIAN Y, ZHAO X, ZHANG L

Coated particle used in hydraulic fracturing composition for treating subterranean formation, comprises particulate substrate, surface copolymer layer having copolymer of monomers e.g. styrene, carbonates, and acrylamides, and resin layer.

LI W, ALSHARAEH E, ALMOHSIN A, BATAWEEL M A

Composition useful for Fifth Generation mobile phone middle frame, comprises polyamide, thermosetting resin, thermally conductive filler, glass fiber, toughening agent, antioxidant and lubricant.

SU X, ZHANG D, QU X, ZHENG Y, LI W

High-efficiency antibacterial heat-conducting wear-resistant layer used for floor, is prepared by blending e.g. resin substrate, graphene filler, ceramic filler, curing agent, solvent, antioxidant and additive, hot pressing, and molding.

XIAO P, WANG Q, LIU H

High thermal conductivity epoxy resin composite material comprises epoxy resin, mixed thermally conductive filler, triethylenetetramine curing agent, acetone and magnesium hydroxide powder.

YUE G