国家/地区 中国（6）
IPC部 B（6） C（6） H（2）
IPC大类 B32（6）
IPC小类 B32B（6）
IPC C08L079/08（6）
发明人 CHEN K（2） YU D（2）
公开年 2022（6）
申请年 2021（6）
专利权人 ITEQ WUXI EL.（2）

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D

Low-expansion coefficient halogen-free resin composition useful in laminate and printed circuit board, comprises e.g. o-cresol epoxy resin, bis(4-maleimidophenyl)methane, polyvalent hydroxy-modified styrene resin, phosphinate and cyanate ester hardener.

CHEN K, YU D

Preparing degradable thickened graphene photothermal conversion mulching film comprises e.g. using optical fiber laser to carry out instantaneous high temperature processing to polyimide film to form graphene powder, and pushing graphene powder onto underlying polymer receiving substrate.

SONG Y, LI N, ZHANG S, WANG Z

Strong and tough polypropylene film, comprises polypropylene, polyimide, lignin, calcium oxide, polydipropyl terephthalate, propylene glycol, isophthalic acid, dicyclopentadiene, styrene, calcium stearate, cyclodextrin, acrylic acid, graphene, deionized water, dispersant, and lubricant.

LV D

Preparing halogen-free low-dielectric compatible high-frequency FR4 copper-clad plate comprises using glue components comprising resins, coupling agents, catalysts, fillers and solvents comprising dimethylbenzene and cyclohexanone.

JIANG D, QIN W, FU J, LIU J, ZHENG B, LUAN H, CHEN C, WANG L

Preparing modified phthalonitrile resin-based composite material comprises mixing phthalonitrile resin with graphene oxide, modifying to obtain modified phthalonitrile resin, mixing modified phthalonitrile resin with bismaleimide, disposing carbon fibers for impregnation, pressing and curing.

XU H, JIA L, MAO S, YU M, WANG X, LI A, HU Y