国家/地区 中国（100）
IPC部 C（100） B（19） H（11）
G（4） A（2）
IPC大类 C08（100）
IPC小类 C08L（100） C08K（78） C08J（69）
C08G（20） C09D（11） C09K（9）
C01B（8） H05K（8） B32B（6）
B29D（4） C09J（3） B05D（2）
B33Y（2） B82Y（2） H01B（2）
IPC C08L079/08（100）
发明人 LI Y（6） LIU G（6） XU Z（5）
LI L（4） LIU P（4） WANG D（4）
WANG G（4） WANG J（4） ZHANG Q（4）
ZHANG S（4） ZHANG Y（4） ZHOU Y（4）
BAO X（3） CHEN C（3） JIN W（3）
公开年 2021（63） 2022（34） 2023（3）
申请年 2021（100）
专利权人 ZHEJIANG ZHO.（7） UNIV SICHUAN（3） AEROSPACE RE.（2） CHINA TOBACC.（2）
DATONG GONGJ.（2） ENANO SHENZH.（2） FUERDE NEW M.（2） GUANGDONG SU.（2）
GUIZHOU AERO.（2） ITEQ WUXI EL.（2） NINGBO INST .（2） SUZHOU AILEG.（2）
UNIV JILIN（2）

High-smooth and heat-insulating polyimide film useful for motors, comprises e.g. polyamic acid, distilled water, N-methylpyrrolidone, calcium stearate, polyamide resin, polyethylene wax, polyethylene, polyisobutylene, graphene powder, silicon dioxide powder, and calcium carbonate powder.

TIAN B, ZOU W, JIN Y, DING Y

Preparing ultra-high elastic polyimide fiber/graphene composite gas gel comprises e.g. dispersing polyimide chopped fiber in alkali solution, performing surface modification, mixing graphene solution dispersion liquid with polyimide chopped fiber, dialyzing, freezing and drying.

FENG Y, YIN W, FENG W

Preparing modified graphene oxide useful in composite pipe material and preparing implanted medical appliances, comprises mixing graphene oxide, solvent and modifying agent comprising diamine composite containing two primary amine groups, and reacting to obtain modified oxidized graphene oxide.

LI Z, YIN Z, FU X, QIN M

Preparing aerogel composite heat-insulating sheet involves mixing aerogel powder with ethanol, dispersing, adding aqueous polytetrafluoroethylene emulsion, fully stirring to obtain floccule, then milling on open mill to obtain aerogel/polytetrafluoroethylene composite material.

HOU Y

Conductive high temperature resistant polyimide composite material comprises surface of conductive fabric prefabricated body, whose surface loaded with nano conductive flocking body and conductive polyimide resin system comprises conductive fillers.

ZHANG H, LI L, WANG G, XIN Y, XU X, YIN X, WANG D, KE H, LI N

Use of conductive ink in reducing the resistivity of a flexible electrode plate after multiple bending, by coating conductive ink on the flexible polar plate under the deformation state, sintering, and spraying solvent, and coating the flexible plate.

YUAN H, YE Y, GUO X, XU X, SUN S, CHEN M, LI W

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D

Low-expansion coefficient halogen-free resin composition useful in laminate and printed circuit board, comprises e.g. o-cresol epoxy resin, bis(4-maleimidophenyl)methane, polyvalent hydroxy-modified styrene resin, phosphinate and cyanate ester hardener.

CHEN K, YU D

High wearable and toughened polybutylene terephthalate material for automobile inhaul cable, comprises polybutylene terephthalate, wearable agent, toughening agent, compatibilizer, antioxidant, lubricant, graphene composite modified polyimide fiber and ionic liquid composite rare earth liquid.

WANG S, ZHANG T, WANG M, WANG K, WANG J

Conductive and heat-conducting polyimide film comprises heat conducting coating, conductive layer, adhesive layer, layer base material, and protective film.

XU W