国家/地区 中国（57）
IPC部 C（59） H（9） B（8）
G（6） F（4） D（2）
IPC大类 C08（59）
IPC小类 C08K（59）
IPC C08L079/08（59）
发明人 PAN J（6） ZHANG L（6） CHEN Y（3）
LI L（3） LI X（3） WANG X（3）
WANG Y（3） XU Z（3） CHEN L（2）
DING P（2） GUO M（2） GUO X（2）
HUO X（2） LI C（2） LI J（2）
公开年 2022（45） 2023（14）
申请年 2022（59）
专利权人 GUANGDE TIAN.（6） BEIJING INST.（2） QINGDAO ADVA.（2） UNIV BEIJING.（2）
UNIV JIANGNA.（2） UNIV NANJING.（2） UNIV SHANGHA.（2）

Producing polyimide powder used in display, automobile, medical, battery, and aerospace, involves preparing polyamic acid solution, preparing polyimide mixed solution by heating polyamic acid solution, and filtering and drying precipitate present in mixed solution to obtain polyimide powder.

LEE H S, YANG M S, LEE I S, LEE H, YANG M

Preparing polyimide-based shape-memory composite aerogel by carrying out polycondensation reaction of diamine monomer and dianhydride monomer in N-methylpyrrolidone, placing obtained polyamic acid gel in water, freeze-drying, and dispersing polyamic acid filaments and graphene oxide in water.

LI L, GUO M, LIU T

Polyamideimide composite material useful for sealing valve body, comprises silicon dioxide/polyamide-imide composite material, epoxy resin, carbon fiber, acetone, dibutyl phthalate, graphene, vulcanizing agent, accelerators, and anti-aging agent.

TAO F, ZHU J

Bismaleimide resin composite material useful for carbon fiber prepreg, comprises o-diallyl bisphenol A, bismaleimide resin, accelerator, and graphene.

CHEN L, LIU H, JIAO L, LV X

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Preparing 3D printing organic-inorganic composite airgel useful in e.g. thermal insulation materials comprises adding inorganic nanomaterials to polyamic acid solution, mixing, and carrying out sol-gel treatment to composite ink and freeze drying composite ink and heat imidizing.

YUAN S, YANG Y, LI L, LIU T, XUE T, FAN W

Preparing polyimide film comprises e.g. mixing film polyimides, thermally conductive fillers and solvents, uniformly dispersing to obtain mixed dispersion, and coating the dispersion on substrate, and synthesizing by polymerization.

NIU S, SUN X

Asphalt-based carbon fiber composite material used in e.g. aerospace structural and functional integration material, comprises asphalt-based carbon fiber, aromatic fused ring molecular inner layer, graphene middle layer and aromatic fused ring molecular outer layer.

YANG X, GAO S, JIANG X, LI G

Polyvinyl chloride regenerated polyvinyl chloride plastic useful for air conditioner, comprises polyvinyl chloride plastic base material covered with woven carbon fiber layer and flame-retardant heat-resistant layer, and woven carbon fiber layer adhered on polyvinyl chloride plastic base material.

ZHANG L, PAN J

Fastener useful for composition material, comprises e.g semi-aromatic polyamide imide, pentafluorobenzoyl chloride, anhydrous aluminum chloride, methyl acryloyl chloride, propylene-methyl propane sulfonic acid, methyl vinyl silicon fluorene, phosphorus pentoxide and poly-phosphoric acid.

QIAN H