国家/地区 中国（12） 世界知识产权组织（5） 美国（4） 日本（3） 韩国（3）
IPC部 C（15）
IPC大类 C08（15）
IPC小类 C08L（15）
IPC C08L079/08（15）
发明人 HAM S J（2） JI S Y（2） KIM S H（2）
LIANG X（2） SUN R（2） ZHAO T（2）
公开年 2022（5） 2021（3） 2013（2） 2019（2）
申请年 2021（4）  2020（2）  2022（2） 
专利权人 SAMSUNG ELEC.（2）

Optical film with low haze useful in vehicle-mounted display product manufacturing field e.g. wearable device, comprises e.g. substrate layer comprising first optical surface and second optical surface, and flatness adjusting layer arranged on first optical surface and/or second optical surface.

JU J, LIU J, XU J

Preparing flexible cable used as electric energy or signal transmission device, involves spraying polymer microsphere on cable core, modifying modified graphene oxide, N,N'-(4,4'-methylene diphenyl)bismaleimide, coating sheath material on surface of irradiated cable core and rolling.

LUO X

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S

Use of electromagnetic material modification method in preparing polyimide foam electromagnetic shielding material.

SHI J, YANG D, CHAI X, LU X, DING Z

Flexible heating film comprises conductive structure comprising carbon nanotubes and/or graphene, and polyimide backbone that is chemically linked to aminated conductive structure via anhydride bonds.

ZHENG T, ZHANG M, ZHANG Y, MAO O, ZUO B

Composite material useful for electronic device, preferably galvanic cell, supercapacitor, or fuel cell, comprises polyamide-imide, and nanoplatelets.

HODGE S A, GALHENA D T L, GALHENA D T L G

Bendable electro-thermal film device comprises polyimide base layer coated with organic electric heating film on surface and organic electro-thermal film comprises e.g. graphene, multi-wall carbon nano-tube and carbon black granules.

CHEN D, YANG Y

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Photosensitive polyimide resin composition comprises photosensitive polyimide derivative, photoinitiator, free radical polymeric compound, solvent, alumina, graphene, inorganic clay, silicon oxide and zinc oxide.

HUANG T, ZHUANG C, SHI Y, XIE K, HUANG T C, CHUANG C C, SHIH Y C, HSIEH K H

Composite film comprises substrate film composed of graphene, high molecular polymer, curing agent and coating layer.

SUN R, YE H, ZHAO T, ZHANG B, HU Y, LIANG X