国家/地区 世界知识产权组织（19）
IPC部 C（19）
IPC大类 C08（19）
IPC小类 C09J（19） C08K（15） C08L（8）
C08G（4） C08J（4） H01L（4）
H01B（3） H05K（3） B32B（2）
C08F（2） C09D（2） C09K（2）
G02F（2）
IPC C09J011/04（19）
发明人 CHEN Y（3） HENCKENS A（3） CHICH A（2）
CHIN R（2） DOUGHERTY M（2） ESTRUGA O M（2）
ESTRUGA ORTIGA M（2） ESTRUGAORTIGAMARQUE（2） KIM M（2）
LEE Y（2） LI Y（2） RUFUS I B（2）
WILLIAMS O（2）
公开年 2022（9） 2021（4） 2016（2）
申请年 2021（5）  2020（4）  2016（3）  2022（3）  2019（2） 
专利权人 HENKEL AG C.（3） BMIC LLC（2） BUILDING MAT.（2） SHENZHEN CHI.（2）

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Curable resin composition used in adhesive for optical light receiving and emitting modules, sealing agent for optical light emitting/receiving module, and optical light emitting/receiving module member, comprises epoxy resin, carbon material having graphene laminated structure, and resin.

SUEMATSU M, URAYAMA T, ENAMI T, SATO K

Adhesive composition used for forming adhesive layer for optical member for display device, comprises acrylic copolymer.

JUNG K, KIM M, SONG K, HWANG I, JIN K M, SONGKWANWOOK, HO H

Adhesive film for producing structure e.g. heat-dissipating substrate, is formed of adhesive resin composition that contains thermally conductive filler composed of at least one of graphene having two-dimensional structure and single-walled boron nitride, thermosetting component and binder polymer.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Hybrid adhesive composition useful for electromagnetic wave shielding, comprises conductive metal particles, graphene, adhesive resin and curing agent, where graphene is chemically modified graphene, and adhesive resin is bonded to functional group of chemically modified graphene.

KIM M G, HONG S M, OH J T, KIM J H, KIM J, OH J, HONG X, KIM M, MYEONGGI K

Dispersion optical composition for e.g., polymer film and polymer portion comprises a filler comprising particles, a polymerizable monomer or oligomer, and an additive.

HERB C A, MILLER D D, BZOWEJ E, MCCULLOUGH L A, MCCULLOUGH L, MILLER D, HERB C

Electroconductive composition used as interconnection material, contains resin component containing functionalized polybutadiene, electroconductive filler, curative, core-shell rubber toughener, epoxy reactive diluents and curing agent.

ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, ESTRUGAORTIGAMARQUE

Roofing system that is free of asphalt, comprises a substrate and an adhesive formulation which comprises filler and/or at least one tackifier, at least one process oil, at least one fire retardant, and at least one polymer.

RUFUS I B, CHICH A, WILLIAMS O, CHIN R, DOUGHERTY M, MERCADO R M L, KRAJCA J L

Bonding two substrates for forming bonded assembly by pre-curing thermoset adhesive using radio-frequency energy, where adhesive comprises radio-frequency susceptor, and subjecting thermoset adhesive to heat treatment.

GREEN M, GREUNER J, VASHISTH A, AUVIL T, SOPHIEA D, MASTROIANNI S, GRUNER J, BASIS A, SOPHIA D

Electrically conductive one-component epoxy adhesive composition for e.g. solar cell comprises epoxy resin, at least one ionic constituent as catalyst for epoxy homo-polymerization, electrically conductive particles, and inorganic particles.

POELLER S, WUCHERPFENNIG S, ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, STEINKOGLER S, ESTRUGAORTIGAMARQUE, POHL S