国家/地区 中国（7）
IPC部 B（7）
IPC大类 C08（7）
IPC小类 C08K（7） C08L（7） B32B（4）
B29D（2） C08J（2）
IPC C08K003/04（6） B32B027/08（2） B32B027/30（2）
C08K003/22（2） C08K007/26（2） C08K009/04（2）
C08L009/00（2）
发明人 ZHANG C（7）
公开年 2022（4） 2021（3）
申请年 2021（7）
专利权人

Processing technology of medicinal composite film based on temperature-sensitive technology comprises e.g. coating adhesive on one side of polyester film layer to form first adhesive layer, compounding polyvinylidene chloride film layer with first adhesive layer, and curing.

ZHOU S, ZHANG C, GU S

Preparing light-emitting diode packaging material for emitting white light under excitation of deep ultraviolet light, involves uniformly mixing blue and yellow nitrogen-doped graphene/carbon quantum dots in epoxy resin solution.

LIN J, WANG L, WU X, DU H, CAI X, WEI X, FAN J, YIN X, ZHANG C, LIN T

Rubber composition useful in tread of truck radial tire comprises natural rubber, butadiene rubber, gel graphene and cracked carbon black.

GAO X, LIU L, ZHANG J, ZHANG C, WANG P

Material useful in preparing pipe for underground coal mine, comprises polyvinyl chloride resin, impact modifier, antistatic agent, flame retardant smoke inhibitor, lubricant, heat stabilizer, reinforcing agent and plasticizer.

LI F, FENG J, LI N, MA J, ZHANG C

Epoxy-type copper-clad plate material useful for aluminum substrate, and copper clad laminate, comprises composite resin, accelerator, curing agent and tin dioxide/graphene.

ZHANG C

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Preparing modified graphene fluoroplastic heat exchanger, involves preparing modified graphene fluoroplastic raw materials, fins, seals with graphene coatings required for manufacture of heat exchangers, molding, spraying, drying, packaging.

ZHANG Y, ZHANG C