国家/地区 美国（10）
IPC部 C（10）
IPC大类 C08（10）
IPC小类 C08K（10） C08L（8） C08G（5）
B29C（4） C08J（4） C09K（4）
H01L（3） B33Y（2） B82Y（2）
C01B（2）
IPC C08K003/013（10）
发明人 ZHOU Z（2）
公开年 2021（6） 2022（4）
申请年 2021（10）
专利权人

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Composite material used for forming structural material, comprises closed cell polyurethane matrix portion exhibiting properties associated with wood, and particulate portion homogeneously distributed and suspended in matrix portion, where particulate portion is fiberglass and hemp fiber.

CHRISTY J, ESCOBAR H

Composition for compaction roller for automated fiber placement machine, comprises polyamide, which is polymeric reaction product of diamine and/or aromatic dicarboxylic acid, hydroxy benzoic acid, or their ester or acyl halide derivatives.

CONNELL J W, BELCHER M A, GHOSE S

Heat-conductive silicone heat radiation material used as thermal interface material between heating portion of electronic component and heat sink comprises silicone polymer, heat-conductive inorganic filler, and heat-resistance improver.

KOBAYASHI S, KIMURA Y, SHINGO K, YUKO K

Elastomeric composition for manufacturing articles, contain carbon nanostructures or their fragments comprising multiwalled carbon nanotubes crosslinked into branched, interdigitated, entangled and/or common wall-sharing polymeric structure.

CHEN L, LI J, KYRLIDIS A, DOSHI D A, ZHANG P

Fused filament fabrication filament useful formation of component in layer-wise fashion, comprises feedstock material comprising a polyaryletherketone, and at least one filler means.

CHAPLIN A, DALLAS C, RIDOUT C, RILEY M, THORPE A

Composite useful in photoelectric device, thermal sensing device and electronic device for sensing heat or infrared light, comprises block copolymer including e.g. alkyl-based first structural unit, and polyvalent metal ion.

CHOI Y, KIM T H, WANG L, VINCENZO C, ZHUN Z, CHIARA D, DARAIO C, ZHOU Z, COSTANZA V, CHOI Y S

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Hollow particles used for heat-dissipation fluid composition, comprise inorganic particle layer comprising ceramic particles and conductive carbon-based particles as spherical hollow particles and having empty inner space inside, and polymer coating layer.

KWON K A, CHUN M S, KIM D Y, SEOK C M, KIM D, QUAN W, QUAN J

Composition for forming article e.g. tube, comprises single nylon polymer, conductive nanomaterials, dielectric filler comprising an inorganic, non-conductive, non-platelet nanomaterial containing alumina nanotubes, and dispersing agent.

ZHOU Z, MAPKAR J